Patents by Inventor Tetsuya Kogiso
Tetsuya Kogiso has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10975263Abstract: A thermosetting resin composition contains an epoxy resin, a curing accelerator, a compound having a (meth) acryloyl group, and a compound having an acidic functional group and a weight average molecular weight of 1000 or more. The thermosetting resin composition may further contain a phosphorus-based flame retardant, organic spherical beads, and the like. The thermosetting resin composition preferably substantially does not contain a photopolymerization initiator and a thermal polymerization initiator. The thermosetting resin composition can be used, for example, for forming a cured film on a flexible printed wiring board.Type: GrantFiled: April 21, 2017Date of Patent: April 13, 2021Assignee: KANEKA CORPORATIONInventors: Masayoshi Kido, Tetsuya Kogiso, Tomohiro Koda, Yuji Asahina
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Patent number: 10822465Abstract: A production method for a polyimide with a black resin cured film includes a process of obtaining the black resin cured film by curing a black resin composition on the polyimide. The process of obtaining the black resin cured film includes a process of processing the black resin composition with a predetermined spray impact. A distance from a point where a line that is perpendicular to a surface of the polyimide and that passes through a substrate-adhered edge between the black resin cured film and the polyimide intersects a top portion of the black resin cured film to an edge of the top portion is 25 ?m or less.Type: GrantFiled: November 4, 2016Date of Patent: November 3, 2020Assignee: KANEKA CORPORATIONInventors: Tetsuya Kogiso, Tomohiro Koda, Masayoshi Kido
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Publication number: 20200045833Abstract: A printed wiring board has conductor patterns (12) having a thickness (t1) of 50 ?m or more on an insulating substrate (11). An insulating layer (5) is provided in regions (L) on the conductor patterns and on the insulating substrate in regions (S) between the conductor patterns. A thickness (tL) of the insulating layer on the conductor patterns is preferably 0.1-1 times the conductor thickness (t1). The insulating layer is formed on the conductor patterns and on the insulating substrate between the conductor patterns by printing a resin composition using screen printing and then curing the resin composition. The resin composition has a viscosity of 50-300 P at 25° C. and a thixotropic index of 1.1-3.5. A screen printing plate used for screen printing has a mesh thickness of 2.2 or more times a yarn diameter of yarns.Type: ApplicationFiled: April 17, 2017Publication date: February 6, 2020Applicant: KANEKA CORPORATIONInventors: Yuji ASAHINA, Tetsuya KOGISO, Tomohiro KODA, Masayoshi KIDO
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Publication number: 20190161638Abstract: A thermosetting resin composition contains an epoxy resin, a curing accelerator, a compound having a (meth) acryloyl group, and a compound having an acidic functional group and a weight average molecular weight of 1000 or more. The thermosetting resin composition may further contain a phosphorus-based flame retardant, organic spherical beads, and the like. The thermosetting resin composition preferably substantially does not contain a photopolymerization initiator and a thermal polymerization initiator. The thermosetting resin composition can be used, for example, for forming a cured film on a flexible printed wiring board.Type: ApplicationFiled: April 21, 2017Publication date: May 30, 2019Applicant: KANEKA CORPORATIONInventors: Masayoshi KIDO, Tetsuya KOGISO, Tomohiro KODA, Yuji ASAHINA
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Publication number: 20180319945Abstract: A production method for a polyimide with a black resin cured film includes a process of obtaining the black resin cured film by curing a black resin composition on the polyimide. The process of obtaining the black resin cured film includes a process of processing the black resin composition with a predetermined spray impact. A distance from a point where a line that is perpendicular to a surface of the polyimide and that passes through a substrate-adhered edge between the black resin cured film and the polyimide intersects a top portion of the black resin cured film to an edge of the top portion is 25 ?m or less.Type: ApplicationFiled: November 4, 2016Publication date: November 8, 2018Applicant: KANEKA CORPORATIONInventors: Tetsuya KOGISO, Tomohiro KODA, Masayoshi KIDO
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Patent number: 9835942Abstract: In order to provide (A) a photosensitive resin composition which (i) obtains an excellent tack-free property after being applied and dried, (ii) can be subjected to fine processing so as to have photosensitivity, (iii) prepares a cured film having excellent flexibility, flame retardancy, and electrical insulation reliability, and (iv) has small warpage after being cured, (B) a resin film, (C) an insulating film, and (D) an printed wiring board provided with an insulating film, the photosensitive resin composition containing at least (A) binder polymer; (B) cross-linked polymer particles, whose polymer has a urethane bond in its molecule; (C) thermosetting resin; and (D) photo-polymerization initiator is used.Type: GrantFiled: September 30, 2011Date of Patent: December 5, 2017Assignee: KANEKA CORPORATIONInventors: Yoshihide Sekito, Tomohiro Koda, Tetsuya Kogiso, Masayoshi Kido
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Patent number: 9081276Abstract: The object of the present invention is to provide a photosensitive resin composition which is excellent in: storage stability in a long-term storage; microfabricability; developability; low-temperature curability; flexibility in a cured film; electrical insulation reliability; solder heat resistance; resistance to an organic solvent; and flame retardancy and low in post-curing warpage when processed into a substrate. The object can be attained by use of a photosensitive resin composition production kit which includes at least two or more components including an A component and a B component. The A component contains a (A) compound having a carboxyl group. The B component contains a (B) compound having a reactive group which is reactive to a carboxyl group, a (C) oxime ester photopolymerization initiator, and a (D) compound having a photosensitive group but no carboxyl group.Type: GrantFiled: July 1, 2011Date of Patent: July 14, 2015Assignee: KANEKA CORPORATIONInventors: Tomohiro Koda, Yoshihide Sekito, Tetsuya Kogiso
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Patent number: 8828525Abstract: An object of the present invention is to provide (i) a stiffener-integrated flexible printed circuit board in which a defect such as a blistering is not generated during a reflow process even though a stiffener is attached to a photosensitive resin composition, and (ii) a method for manufacturing the stiffener-integrated flexible printed circuit board. The object can be attained by causing a stiffener-integrated flexible printed circuit board to have a structure in which (A) a stiffener (6), (B) a bonding material (5), (C) a cured film obtained by curing a photosensitive resin composition (4), and (D) a flexible printed circuit board (1) are laminated in this order.Type: GrantFiled: July 8, 2011Date of Patent: September 9, 2014Assignee: Kaneka CorporationInventors: Masayoshi Kido, Tetsuya Kogiso, Yoshihide Sekito
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Patent number: 8754186Abstract: An object of the present invention is to provide a polyimide precursor composition that can be cured at low temperatures (250° C. or lower), while having a low viscosity even at a high concentration, and a method of producing the same. Another object of the present invention is to provide a polyimide coating film obtained from the polyimide precursor composition and having good physical properties, and a method of producing the same. Furthermore, another object of the present invention is to provide a photosensitive resin composition containing the polyimide precursor composition, and a method of producing the same. These objects can be achieved by the polyimide precursor composition containing an imidized tetracarboxylic acid having a specific structure and a diamine having a specific structure.Type: GrantFiled: December 19, 2007Date of Patent: June 17, 2014Assignee: Kaneka CorporationInventors: Kan Fujihara, Tetsuya Kogiso, Yoshihide Sekito
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Publication number: 20130264099Abstract: In order to provide (A) a photosensitive resin composition which (i) obtains an excellent tack-free property after being applied and dried, (ii) can be subjected to fine processing so as to have photosensitivity, (iii) prepares a cured film having excellent flexibility, flame retardancy, and electrical insulation reliability, and (iv) has small warpage after being cured, (B) a resin film, (C) an insulating film, and (D) an printed wiring board provided with an insulating film, the photosensitive resin composition containing at least (A) binder polymer; (B) cross-linked polymer particles, whose polymer has a urethane bond in its molecule; (C) thermosetting resin; and (D) photo-polymerization initiator is used.Type: ApplicationFiled: September 30, 2011Publication date: October 10, 2013Applicant: KANEKA CORPORATIONInventors: Yoshihide Sekido, Tomohiro Koda, Tetsuya Kogiso, Masayoshi Kido
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Publication number: 20130189624Abstract: The object of the present invention is to provide a photosensitive resin composition which is excellent in: storage stability in a long-term storage; microfabricability; developability; low-temperature curability; flexibility in a cured film; electrical insulation reliability; solder heat resistance; resistance to an organic solvent; and flame retardancy and low in post-curing warpage when processed into a substrate. The object can be attained by use of a photosensitive resin composition production kit which includes at least two or more components including an A component and a B component. The A component contains a (A) compound having a carboxyl group. The B component contains a (B) compound having a reactive group which is reactive to a carboxyl group, a (C) oxime ester photopolymerization initiator, and a (D) compound having a photosensitive group but no carboxyl group.Type: ApplicationFiled: July 1, 2011Publication date: July 25, 2013Applicant: KANEKA CORPORATIONInventors: Tomohiro Koda, Yoshihide Sekito, Tetsuya Kogiso
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Publication number: 20130183499Abstract: An object of the present invention is to provide (i) a stiffener-integrated flexible printed circuit board in which a defect such as a blistering is not generated during a reflow process even though a stiffener is attached to a photosensitive resin composition, and (ii) a method for manufacturing the stiffener-integrated flexible printed circuit board. The object can be attained by causing a stiffener-integrated flexible printed circuit board to have a structure in which (A) a stiffener (6), (B) a bonding material (5), (C) a cured film obtained by curing a photosensitive resin composition (4), and (D) a flexible printed circuit board (1) are laminated in this order.Type: ApplicationFiled: July 8, 2011Publication date: July 18, 2013Applicant: KANEKA CORPORATIONInventors: Masayoshi Kido, Tetsuya Kogiso, Yoshihide Sekito
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Publication number: 20100132989Abstract: An object of the present invention is to provide a polyimide precursor composition solution that (i) uses no siloxane diamine, (ii) is curable at low temperature (not more than 250° C.) and (iii) has low viscosity regardless of its high concentration, and a photosensitive resin composition, photosensitive resin film, a thermosetting resin composition, a polyimide insulating film, and a printed wiring board with an insulating film, each of which has good physical properties and is obtained by use of the polyimide precursor composition solution. The foregoing object is attained by using a polyimide precursor composition solution which includes at least a (A) urethane imide oligomer having a terminal carboxylic acid group and a (B) diamino compound and/or isocyanate compound.Type: ApplicationFiled: April 3, 2008Publication date: June 3, 2010Inventors: Kan Fujihara, Yoshihide Sekito, Tetsuya Kogiso
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Publication number: 20100084171Abstract: An object of the present invention is to provide a polyimide precursor composition that can be cured at low temperatures (250° C. or lower), while having a low viscosity even at a high concentration, and a method of producing the same. Another object of the present invention is to provide a polyimide coating film obtained from the polyimide precursor composition and having good physical properties, and a method of producing the same. Furthermore, another object of the present invention is to provide a photosensitive resin composition containing the polyimide precursor composition, and a method of producing the same. These objects can be achieved by the polyimide precursor composition containing an imidized tetracarboxylic acid having a specific structure and a diamine having a specific structure.Type: ApplicationFiled: December 19, 2007Publication date: April 8, 2010Applicant: KANEKA CORPORATIONInventors: Kan Fujihara, Tetsuya Kogiso, Yoshihide Sekito