Patents by Inventor Tetsuya Kouchi

Tetsuya Kouchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-frequency circuit device and transmitter/receiver
    Patent number: 6891452
    Abstract: A high-frequency circuit device includes a dielectric substrate. A planar conductor is provided on each of top and bottom surfaces of the dielectric substrate and a slot line is formed on the top surface. Also, undesired-wave propagation preventing circuits, each including multistage band-elimination filters, are provided on the top surface of the dielectric substrate, with the slot line therebetween. Each of the band-elimination filters includes two conductive lines and a resonator which is provided at a portion of one of the conductive lines and which includes two spiral lines. Accordingly, propagation of an undesired wave of the band whose center is the resonance frequency of the resonator can be prevented.
    Type: Grant
    Filed: February 26, 2003
    Date of Patent: May 10, 2005
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shigeyuki Mikami, Kiyoharu Kochi, Akiko Kochi, Hiroyasu Matsuzaki, Kazutaka Mukaiyama, Koichi Sakamoto, Yohei Ishikawa, Tetsuya Kouchi
  • Radio frequency module, communication device, and radar device
    Patent number: 6628230
    Abstract: A radio frequency module includes a multi-chip substrate divided into separate substrates. An antenna block, a duplexer block, a transmitter block, a receiver block, and an oscillator block are formed on the separate substrates. Connection resonators, which are connected to transmission lines, are formed at edges of the separate substrates. The connection resonators on adjacent ones of the separate substrates are arranged close to each other such that the two adjacent resonators are electromagnetically coupled to each other. Thus, the transmission lines on the separate substrates are interconnected, and a signal can be propagated among the blocks.
    Type: Grant
    Filed: September 19, 2002
    Date of Patent: September 30, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shigeyuki Mikami, Tetsuya Kouchi, Hiroyasu Matsuzaki, Kazutaka Mukaiyama, Koichi Sakamoto, Toshiro Hiratsuka, Takatoshi Kato, Yohei Ishikawa
  • Radio frequency module, communication device, and radar device
    Publication number: 20030085836
    Abstract: A radio frequency module includes a multi-chip substrate divided into separate substrates. An antenna block, a duplexer block, a transmitter block, a receiver block, and an oscillator block are formed on the separate substrates. Connection resonators, which are connected to transmission lines, are formed at edges of the separate substrates. The connection resonators on adjacent ones of the separate substrates are arranged close to each other such that the two adjacent resonators are electromagnetically coupled to each other. Thus, the transmission lines on the separate substrates are interconnected, and a signal can be propagated among the blocks.
    Type: Application
    Filed: September 19, 2002
    Publication date: May 8, 2003
    Inventors: Shigeyuki Mikami, Tetsuya Kouchi, Hiroyasu Matsuzaki, Kazutaka Mukaiyama, Koichi Sakamoto, Toshiro Hiratsuka, Takatoshi Kato, Yohei Ishikawa