Abstract: According to one embodiment, a structure evaluation system according to an embodiment includes a plurality of sensors, a position locator, a corrector, and an evaluator. The plurality of sensors detect elastic waves generated from a structure. The position locator is configured to locate positions of sources of a plurality of elastic waves detected by the plurality of sensors on the basis of the plurality of elastic waves. The corrector is configured to correct information based on the position location in the position locator using a correction value which is determined according to a temperature of the structure. The evaluator is configured to evaluate a deterioration state of the structure on the basis of the corrected information.

Abstract: A sensor module according to an embodiment includes a sensor; a sensor holder that holds the sensor and includes a pressing force application portion to apply a pressing force to press the sensor toward a measurement target object side; an adhesion portion that adheres the sensor holder to the measurement target object by an adhesion force; and a change mechanism that changes a relative magnitude relationship between the pressing force and the adhesion force.

Abstract: According to one embodiment, a sensor attachment/detachment device of the embodiment includes a sensor, a bonding member, a support portion, and a release execution portion. The bonding member is bonded to a first surface of the sensor and has a function of decreasing an adhesive force. The support portion can support the sensor by directly contacting a second surface of the sensor or via another functional portion. The release execution portion performs a process of releasing the bonding member from the object by decreasing the adhesive force of the bonding member after the sensor is attached to the object by the bonding member.

Abstract: An adhesion/peeling method according to an embodiment includes adhering a first surface side of an electrically peelable adhesive sheet to a predetermined position of a fixation target object, wherein the electrically peelable adhesive sheet is formed of an electro-peeling adhesive having adhesiveness on the first surface side and a second surface side thereof, and the adhesiveness of the electro-peeling adhesive is lowered due to an input of a voltage; adhering a first electrode of an adherend including the first electrode formed of a conductor to the second surface side of the electrically peelable adhesive sheet; containing a liquid at the predetermined position of the fixation target object to temporarily form a second electrode with conductivity on a surface of the fixation target object; and inputting a predetermined voltage between the first electrode and the second electrode to peel of the electrically peelable adhesive sheet from the fixation target object.

Abstract: An object adhesion/peeling method according to an embodiment includes adhering a adhesion target object to a second surface side of an adhesive sheet, wherein the adhesive sheet includes adhesive surfaces on a first surface side and the second surface side, and a first electrode and a second electrode provided to be adjacent to the first electrode are provided on the first surface side; adhering the first surface side of the adhesive sheet to a fixation target surface; inputting a predetermined voltage to the first electrode and the second electrode to generate a potential difference based on the predetermined voltage in a direction orthogonal to a layer thickness direction of the adhesive sheet; and causing an electrochemical reaction on the first surface side of the adhesive sheet to peel off the adhesive sheet from the fixation target surface.

Abstract: A semiconductor device 10 includes a pair of electrodes 16 and a conductive connection member 21 electrically bonded to the pair of electrodes 16. At least a portion of a perimeter of a bonding surface 24 of at least one of the pair of electrodes 16 and the conductive connection member 21 includes an electromigration reducing area 22.

Abstract: According to one embodiment, an electronic device comprises a circuit board, an electrical component, and a measurement unit. The circuit board has a first face. The electrical component includes a second face electrically connected to the first face via a bonding material, a first end in a first direction along the second face, and a second end. The second end is opposite to the first end in the first direction. The measurement unit is configured to measure a characteristic changing depending on a conductivity of the bonding material. A first distance between the first face and the first end is shorter than a second distance between the first face and the second end. The measurement unit includes a first measurement unit configured to measure the characteristic of a part of the bonding material. The part is adjacent to the first end.

Abstract: A thermal printer includes: a plurality of heat elements that are to be heated by applying an electrical power; a printing controller that applies a first electrical power to heat elements not to be used for printing, the first electrical power depending on the number of heat elements not to be used for printing among the plurality of heat elements; and a thermal head that prints using the plurality of heat elements.

Abstract: A pattern accuracy detecting apparatus includes a stage for supporting a substrate, an optical warpage detecting unit that measures a shape of a substrate disposed on the stage, an optical pattern detection unit that detects a position of a pattern on the substrate, and a processing unit that corrects the detected pattern position based on the measured shape of the substrate.

Abstract: According to an embodiment, mask manufacturing equipment includes a detector, an irradiator, a calculator, and a controller. The detector detects positional deviation of a pattern formed on a mask substrate. The irradiator irradiates the mask substrate with laser light to form a heterogeneous layer that is expanded in volume in the mask substrate. The calculator calculates an area periphery irradiation condition under which the irradiator is caused to emit laser light to a peripheral area of the pattern on the basis of the positional deviation detected by the detector so that the pattern area is reduced by forming the heterogeneous layer in the peripheral area of the pattern. The controller controls the irradiator to form the heterogeneous layer in the peripheral area of the pattern according to the area periphery irradiation condition.

Abstract: A pattern accuracy detecting apparatus includes a stage for supporting a substrate, an optical warpage detecting unit that measures a shape of a substrate disposed on the stage, an optical pattern detection unit that detects a position of a pattern on the substrate, and a processing unit that corrects the detected pattern position based on the measured shape of the substrate.

Abstract: A thermal printer includes: a plurality of heat elements that are to be heated by applying an electrical power; a printing controller that applies a first electrical power to heat elements not to be used for printing, the first electrical power depending on the number of heat elements not to be used for printing among the plurality of heat elements; and a thermal head that prints using the plurality of heat elements.

Abstract: A thermal printer includes: a plurality of heat elements that are to be heated by applying an electrical power; a printing controller that applies a first electrical power to heat elements not to be used for printing, the first electrical power depending on the number of heat elements not to be used for printing among the plurality of heat elements; and a thermal head that prints using the plurality of heat elements.

Abstract: A template for imprinting according to an embodiment configured to be pressed onto a semiconductor wafer to transfer thereto a pattern, and may include an imprint mask on which the pattern is formed, a photomask substrate on which the imprint mask is provided, and a plurality of deformation controllers that are provided at the photomask substrate outside a circumference of the imprint mask, and are configured to deform the photomask substrate.

Abstract: A thermal printer includes: a plurality of heat elements that are to be heated by applying an electrical power; a printing controller that applies a first electrical power to heat elements not to be used for printing, the first electrical power depending on the number of heat elements not to be used for printing among the plurality of heat elements; and a thermal head that prints using the plurality of heat elements.

Abstract: According to one embodiment, an electronic device comprises a circuit board, an electrical component, and a measurement unit. The circuit board has a first face. The electrical component includes a second face electrically connected to the first face via a bonding material, a first end in a first direction along the second face, and a second end. The second end is opposite to the first end in the first direction. The measurement unit is configured to measure a characteristic changing depending on a conductivity of the bonding material. A first distance between the first face and the first end is shorter than a second distance between the first face and the second end. The measurement unit includes a first measurement unit configured to measure the characteristic of a part of the bonding material. The part is adjacent to the first end.

Abstract: According to one embodiment, a lighting apparatus includes a board, a base, a globe, a housing, and a cap part. The board is provided with a light emitting element to emit light. The board is thermally connected to the base. The globe is provided on the base to cover the light emitting element. The globe includes a maximum diameter part in which an external diameter of the globe is maximum. The housing is thermally connected to the base. The housing includes a cylindrical radiator through which air flows. The cap part is attached to the housing. One end part of the radiator is located between the cap part and the maximum diameter part.

Abstract: According to an embodiment, mask manufacturing equipment includes a detector, an irradiator, a calculator, and a controller. The detector detects positional deviation of a pattern formed on a mask substrate. The irradiator irradiates the mask substrate with laser light to form a heterogeneous layer that is expanded in volume in the mask substrate. The calculator calculates an area periphery irradiation condition under which the irradiator is caused to emit laser light to a peripheral area of the pattern on the basis of the positional deviation detected by the detector so that the pattern area is reduced by forming the heterogeneous layer in the peripheral area of the pattern. The controller controls the irradiator to form the heterogeneous layer in the peripheral area of the pattern according to the area periphery irradiation condition.

Abstract: According to one embodiment, an electronic apparatus includes a first wall, a second wall, a moving portion, a flexible cable, and a first contact portion. The moving portion is located between the first wall and the second wall. The cable comprises a curving portion between the first wall and the second wall, a first portion brought into contact with the first wall, and a second portion brought into contact with the second wall. The first contact portion is provided on the first wall and is in contact with the first portion of the cable. The cable can slide more smoothly on the first contact portion than on the second wall.

Abstract: According to an embodiment, a semiconductor component includes a circuit board; a semiconductor chip; and a bond part formed by sintering a paste containing metal particles between the circuit board and the semiconductor chip to bond the circuit board and the semiconductor chip. The bond part includes a first area immediately under the semiconductor chip and a second area adjacent to the first area. The second area has a porosity equal to or lower than that of the first area.