Patents by Inventor Tetsuya Nakatsuka
Tetsuya Nakatsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11244877Abstract: Provided is a sealing structure including a housing that houses a heat generating member or a heat dissipation member thereinside, and a resin that is filled in the housing. In a sectional view, the housing includes a first recess portion in a position facing the heat generating member or the heat dissipation member.Type: GrantFiled: April 4, 2016Date of Patent: February 8, 2022Assignee: Hitachi, Ltd.Inventors: Tetsuya Nakatsuka, Shinya Kawakita, Susumu Ishida, Isamu Yoshida, Osamu Ikeda
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Publication number: 20200303272Abstract: Provided is a sealing structure including a housing that houses a heat generating member or a heat dissipation member thereinside, and a resin that is filled in the housing. In a sectional view, the housing includes a first recess portion in a position facing the heat generating member or the heat dissipation member.Type: ApplicationFiled: April 4, 2016Publication date: September 24, 2020Inventors: Tetsuya NAKATSUKA, Shinya KAWAKITA, Susumu ISHIDA, Isamu YOSHIDA, Osamu IKEDA
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Patent number: 8907475Abstract: Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi alloy layer. The Sn—Bi alloy, preferably, comprises 1 to 20 wt % Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn—Bi alloy layer thereby obtaining an enough bonding strength.Type: GrantFiled: June 21, 2013Date of Patent: December 9, 2014Assignee: Renesas Electronics CorporationInventors: Hanae Shimokawa, Tasao Soga, Hiroaki Okudaira, Toshiharu Ishida, Tetsuya Nakatsuka, Yoshiharu Inaba, Asao Nishimura
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Patent number: 8699187Abstract: A manufacturing method for a head-stack assembly. The method includes preparing a head-stack assembly. The method further includes placing a connection pad forming surface of a connector tab formed on an end of the trace so as to be positioned opposite to an edge of a circuit board; sliding an elastic component along a backside of the connection pad forming surface; and, stopping the elastic component on the backside and pressing the backside with the elastic component so as to press the connection pad forming surface against the edge. In addition, the method includes metal-joining the connector tab and a connection pad of the circuit board by applying heat to a connection pad of the connector tab and the connection pad on the circuit board while pressing the connection pad forming surface against the edge with the elastic component; and, removing the elastic component after the metal-joining.Type: GrantFiled: December 18, 2009Date of Patent: April 15, 2014Assignee: HGST Netherlands B.V.Inventors: Tetsuya Nakamura, Takahiro Sakai, Masahiko Katoh, Yasushi Inoue, Tetsuya Nakatsuka, Satoshi Kaneko, Masashi Okubo
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Publication number: 20130286621Abstract: Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi alloy layer. The Sn—Bi alloy, preferably, comprises 1 to 20 wt % Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn—Bi alloy layer thereby obtaining an enough bonding strength.Type: ApplicationFiled: June 21, 2013Publication date: October 31, 2013Inventors: Hanae SHIMOKAWA, Tasao SOGA, Hiroaki OKUDAIRA, Toshiharu ISHIDA, Tetsuya NAKATSUKA, Yoshiharu INABA, Asao NISHIMURA
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Patent number: 8503189Abstract: Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi alloy layer. The Sn—Bi alloy, preferably, comprises 1 to 20 wt % Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn—Bi alloy layer thereby obtaining an enough bonding strength.Type: GrantFiled: May 4, 2010Date of Patent: August 6, 2013Assignee: Renesas Electronics CorporationInventors: Hanae Shimokawa, Tasao Soga, Hiroaki Okudaira, Toshiharu Ishida, Tetsuya Nakatsuka, Yoshiharu Inaba, Asao Nishimura
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Patent number: 8179631Abstract: Embodiments of the present invention help to achieve a solder joining structure having high reliability, in which even if a componential material of a flange of a feed-through of a sealed magnetic disk drive is an iron-based material such as Kovar™, and a componential material of a base of the drive is an aluminum-based alloy, leakage of low-density gas is dramatically reduced. According to one embodiment, a base has a stepped portion in the inside of a periphery of an opening, and an inclined surface extending to the outside of the base is formed at an edge of a surface of the stepped portion, on which a flange of a feed-through is placed, thereby when the stepped portion of the base is joined by soldering with the flange of the feed-through, a solder fillet is formed not only in the inside of the base, but also in the outside thereof.Type: GrantFiled: April 21, 2008Date of Patent: May 15, 2012Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Akihiko Aoyagi, Teruhiro Nakamiya, Takashi Kouno, Hitoshi Shindo, Tetsuya Nakatsuka
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Patent number: 8022551Abstract: Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu, or other materials and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.Type: GrantFiled: April 7, 2006Date of Patent: September 20, 2011Assignee: Renesas Electronics CorporationInventors: Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Kazuma Miura, Mikio Negishi, Hirokazu Nakajima, Tsuneo Endoh
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Patent number: 8020747Abstract: Along with miniaturization of a solder connection portion in a bump repair or a local reflow, a void generated at the time of soldering remains in a solder to remarkably reduce connection strength, and there occurs a non-connection phenomenon in which the solder connection portion and a solder paste are melted, but are not fused with each other. During melting of a solder, a target component is clamped, ultrasonic oscillation is directly applied only to the target component. Further, start of solidification of the solder connection portion is detected by change of an electric impedance of a transducer while applying the ultrasonic oscillation, and the clamp is released before a substrate is warped.Type: GrantFiled: July 7, 2009Date of Patent: September 20, 2011Assignee: Hitachi, Ltd.Inventors: Tetsuya Nakatsuka, Masato Nakamura
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Publication number: 20110109996Abstract: A manufacturing method for a head-stack assembly. The method includes preparing a head-stack assembly. The method further includes placing a connection pad forming surface of a connector tab formed on an end of the trace so as to be positioned opposite to an edge of a circuit board; sliding an elastic component along a backside of the connection pad forming surface; and, stopping the elastic component on the backside and pressing the backside with the elastic component so as to press the connection pad forming surface against the edge. In addition, the method includes metal joining the connector tab and a connection pad of the circuit board by applying heat to a connection pad of the connector tab and the connection pad on the circuit board while pressing the connection pad forming surface against the edge with the elastic component; and, removing the elastic component after the metal joining.Type: ApplicationFiled: December 18, 2009Publication date: May 12, 2011Inventors: Tetsuya Nakamura, Takahiro Sakai, Masahiko Katoh, Yasushi Inoue, Tetsuya Nakatsuka, Satoshi Kaneko, Masashi Okubo
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Patent number: 7911062Abstract: The present invention proposes a semiconductor device including a semiconductor chip having a plurality of electrodes, a plurality of leads electrically connected to the plurality of electrodes of the semiconductor chip by bonding wires, and a resin for implementing the semiconductor chip, wherein the plurality of leads are comprised of two or more kinds of leads having different rigidities.Type: GrantFiled: February 2, 2007Date of Patent: March 22, 2011Assignee: Hitachi, Ltd.Inventors: Tetsuya Nakatsuka, Koji Serizawa
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Publication number: 20100328815Abstract: Due to a difference in coefficient of linear expansion between the constituent material of the flange and the constituent material of the base of the feedthrough, the solder material which joins these materials is unable to withstand the thermomechanical loading that is generated between these heterogeneous materials during their actual usage for a long period and, as a result, cracks formed in the solder-joined portion therebetween create low-density gas leakage paths that reduce actual lifespan to less than 5 years. Disclosed is a magnetic disk device comprising a magnetic disk, a magnetic head for recording and reproducing information onto and from the magnetic disk, a base, a feedthrough solder-joined to the base, and a solder-joined portion for joining the base and the feedthrough, wherein a recess portion is provided in the perimeter edge of the solder-joined portion of the base.Type: ApplicationFiled: January 29, 2009Publication date: December 30, 2010Applicant: Hitachi, Ltd.Inventors: Tetsuya Nakatsuka, Masato Nakamura, Satoshi Kaneko
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Publication number: 20100214753Abstract: Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi alloy layer. The Sn—Bi alloy, preferably, comprises 1 to 20 wt % Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn—Bi alloy layer thereby obtaining an enough bonding strength.Type: ApplicationFiled: May 4, 2010Publication date: August 26, 2010Inventors: Hanae SHIMOKAWA, Tasao Soga, Hiroaki Okudaira, Toshiharu Ishida, Tetsuya Nakatsuka, Yoshiharu Inaba, Asao Nishimura
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Patent number: 7722962Abstract: A solder foil formed from a material comprising particles of Cu, etc. as metal particles and Sn particles as solder particles by rolling is suitable for solder bonding at a high temperature side in temperature-hierarchical bonding, and semiconductor devices and electronic devices produced by use of such solder bonding have distinguished reliability of mechanical characteristics, etc.Type: GrantFiled: December 19, 2001Date of Patent: May 25, 2010Assignee: Renesas Technology Corp.Inventors: Tasao Soga, Hanae Hata, Toshiharu Ishida, Kanko Ishida, legal representative, Tetsuya Nakatsuka, Masahide Okamoto, Kazuma Miura
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Patent number: 7709746Abstract: Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi alloy layer. The Sn—Bi alloy, preferably, comprises 1 to 20 wt % Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn—Bi alloy layer thereby obtaining an enough bonding strength.Type: GrantFiled: January 13, 2006Date of Patent: May 4, 2010Assignee: Renesas Technology Corp.Inventors: Hanae Shimokawa, Tasao Soga, Hiroaki Okudaira, Toshiharu Ishida, Tetsuya Nakatsuka, Yoshiharu Inaba, Asao Nishimura
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Publication number: 20100006624Abstract: Along with miniaturization of a solder connection portion in a bump repair or a local reflow, a void generated at the time of soldering remains in a solder to remarkably reduce connection strength, and there occurs a non-connection phenomenon in which the solder connection portion and a solder paste are melted, but are not fused with each other. During melting of a solder, a target component is clamped, ultrasonic oscillation is directly applied only to the target component. Further, start of solidification of the solder connection portion is detected by change of an electric impedance of a transducer while applying the ultrasonic oscillation, and the clamp is released before a substrate is warped.Type: ApplicationFiled: July 7, 2009Publication date: January 14, 2010Inventors: Tetsuya Nakatsuka, Masato Nakamura
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Publication number: 20080259503Abstract: Embodiments of the present invention help to achieve a solder joining structure having high reliability, in which even if a componential material of a flange of a feed-through of a sealed magnetic disk drive is an iron-based material such as kovar, and a componential material of a base of the drive is an aluminum-based alloy, leakage of low-density gas is dramatically reduced. According to one embodiment, a base has a stepped portion in the inside of a periphery of an opening, and an inclined surface extending to the outside of the base is formed at an edge of a surface of the stepped portion, on which a flange of a feed-through is placed, thereby when the stepped portion of the base is joined by soldering with the flange of the feed-through, a solder fillet is formed not only in the inside of the base, but also in the outside thereof.Type: ApplicationFiled: April 21, 2008Publication date: October 23, 2008Inventors: Akihiko Aoyagi, Teruhiro Nakamiya, Takashi Kouno, Hitoshi Shindo, Tetsuya Nakatsuka
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Publication number: 20080261001Abstract: Disclosed is a low thermal resistance surface mount component and a mounting substrate bump-connected therewith, capable of removing a soldered low thermal resistance surface mount component from a circuit board without harming the performance of the circuit board or the performance of the low thermal resistance surface mount component. The solder bumps 3 in an area approaching the periphery 2 of the low thermal resistance surface mount component 1 are composed of a solder of a melting point lower than that of the solder bumps 3 in an area approaching the center. The low thermal resistance surface mount component 1 on the circuit board can be removed by partial heating and by melting the solder bumps. However, when the component is partially heated in this manner, the heating temperature declines approaching the periphery compared to that of the center of the low thermal resistance surface mount component 1.Type: ApplicationFiled: February 28, 2005Publication date: October 23, 2008Inventors: Tetsuya Nakatsuka, Koji Serizawa, Shosaku Ishihara, Toshio Saeki
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Publication number: 20080062665Abstract: There is proposed a mounting structure including a plurality of components each having a plurality of solder bumps, a substrate having a plurality of lands, and a solder connecting portion for connecting the solder bump and the land, wherein the land provided in an outer peripheral portion of the substrate is smaller than that of the land in a central portion of the substrate.Type: ApplicationFiled: July 27, 2007Publication date: March 13, 2008Inventors: TETSUYA NAKATSUKA, Koji Serizawa
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Publication number: 20070210139Abstract: The present invention proposes a semiconductor device including a semiconductor chip having a plurality of electrodes, a plurality of leads electrically connected to the plurality of electrodes of the semiconductor chip by bonding wires, and a resin for implementing the semiconductor chip, wherein the plurality of leads are comprised of two or more kinds of leads having different rigidities.Type: ApplicationFiled: February 2, 2007Publication date: September 13, 2007Inventors: Tetsuya NAKATSUKA, Koji Serizawa