Patents by Inventor Tetsuya Nonoshita

Tetsuya Nonoshita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CMP pad conditioner
    Patent number: 7540802
    Abstract: A CMP pad conditioner is provided with a grinding part formed by fixing abrasive grains on a metal base by soldering, wherein the grinding part has a flat part near an inner periphery and an inclined part near an outer periphery, wherein abrasive grains having regular shapes are fixed to the flat part, and wherein abrasive grains having acute shapes are fixed to the inclined part.
    Type: Grant
    Filed: March 7, 2007
    Date of Patent: June 2, 2009
    Assignees: Noritake Co., Limited, Noritake Super Abrasive Co., Ltd.
    Inventors: Tetsuya Nonoshita, Naoki Toge
  • CMP pad conditioner
    Publication number: 20070218821
    Abstract: A CMP pad conditioner is provided with a grinding part formed by fixing abrasive grains on a metal base by soldering, wherein the grinding part has a flat part near an inner periphery and an inclined part near an outer periphery, wherein abrasive grains having regular shapes are fixed to the flat part, and wherein abrasive grains having acute shapes are fixed to the inclined part.
    Type: Application
    Filed: March 7, 2007
    Publication date: September 20, 2007
    Applicants: NORITAKE CO., LIMITED, NORITAKE SUPER ABRASIVE CO., LTD.
    Inventors: Tetsuya Nonoshita, Naoki Toge