Patents by Inventor Tetsuya Ohtani
Tetsuya Ohtani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200125145Abstract: The chassis member includes multiple plate-like fiber-reinforced resin members and a frame part made of material including at least resin. The frame part is bonded to respective outer peripheral end surfaces of the fiber-reinforced resin members and joins the multiple fiber-reinforced resin members together.Type: ApplicationFiled: December 20, 2018Publication date: April 23, 2020Applicant: LENOVO (SINGAPORE) PTE. LTD.Inventors: Fumitake Mizoguchi, Hiroaki Agata, Tetsuya Ohtani
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Patent number: 10420230Abstract: A support can be easily attached to and is less likely to separate from an opening of a chassis of an electronic device. The support has a first elastic member having a recessed portion and configured to be fitted into the opening so that an opening surface of the recessed portion is directed to an inside of the chassis, and a second member having a protruding portion configured to be fitted into the recessed portion of the first member.Type: GrantFiled: August 11, 2017Date of Patent: September 17, 2019Assignee: LENOVO (SINGAPORE) PTE. LTD.Inventors: Yoshiharu Uchiyama, Shigehiro Horiuchi, Shigeki Mori, Tetsuya Ohtani, Hiroaki Agata
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Publication number: 20180077809Abstract: The present invention provides a support which can be easily attached to and is less likely to separate from an opening of a chassis of an electronic device. The support has a first elastic member having a recessed portion and configured to be fitted into the opening so that an opening surface of the recessed portion is directed to an inside of the chassis, and a second member having a protruding portion configured to be fitted into the recessed portion of the first member.Type: ApplicationFiled: August 11, 2017Publication date: March 15, 2018Applicant: LENOVO (SINGAPORE) PTE. LTD.Inventors: Yoshiharu Uchiyama, Shigehiro Horiuchi, Shigeki Mori, Tetsuya Ohtani, Hiroaki Agata
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Patent number: 9326396Abstract: A casing for electronic equipments is disclosed. The casing includes a first region and a second region. The first region is formed by a foamed layer provided between an outer rigid layer and an inner rigid layer. The foamed layer isolates the outer rigid layer from the inner rigid layer. The second region is formed by a single layer of material, and the single layer of material is joined to the outer rigid layer, the formed layer and the inner rigid layer.Type: GrantFiled: March 13, 2013Date of Patent: April 26, 2016Assignee: LENOVO (SINGAPORE) PTE LTDInventors: Fumitake Mizoguchi, Tetsuo Ogawa, Tetsuya Ohtani, Hiroaki Agata
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Patent number: 9317074Abstract: The invention broadly contemplates an electronic apparatus that provides improved antenna characteristics, while maintaining a thin size and light weight. The electronic apparatus of the present invention includes a display casing having a nonconductive resin region and a conductive resin region in a bottom surface thereof; a display module accommodated in the display casing; an antenna disposed in the nonconductive resin region; and a system casing accommodating a wireless module connected to the antenna. By disposing the antenna in the nonconductive resin region formed in the bottom surface of the display casing, it is possible to secure high radio wave sensitivity while preventing an antenna mounting portion from being exposed to the outside of the display casing. The casing structure of the electronic apparatus does not become thick because of butt joining even when the joint portions are in a projection area of an LCD module.Type: GrantFiled: January 9, 2009Date of Patent: April 19, 2016Assignee: Lenova (Singapore) Pte. Ltd.Inventors: Gang Ji, Tetsuya Ohtani, Takayuki Morino, Akinori Uchino
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Patent number: 9095046Abstract: Devices and methods are provided for connecting device cover components. In general, the devices and methods can allow first and second covers of an electronic device to be connected together at a plurality of attachment points without any gap space between the first and second covers at the attachment points. In an exemplary embodiment, an electronic device can include a housing that has first and second covers attached to one another at a plurality of attachment points. The first cover can be formed from a first material, and the second cover can be formed from a second, different material. The first material can be a softer material than the second material, which can allow the second cover to penetrate into and deform the first cover during manufacturing of the housing such that no gap space is present between the first and second covers at each of the attachment points.Type: GrantFiled: March 6, 2013Date of Patent: July 28, 2015Assignee: LENOVO (SINGAPORE) PTE. LTD.Inventors: Akinori Uchino, Tetsuya Ohtani, Masahiro Kitamura, Tatsuya Ushioda
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Publication number: 20150100534Abstract: A state diagnosing method diagnoses a state of an operation of the diagnosis target based on waveform data. A waveform representing values of time-series data, the time axis of which is configured to set a start time of an operation of the diagnosis target or a changing time of an operation of the diagnosis target as an origin, is obtained as a target waveform. A similarity between a reference waveform representing a normal state or an abnormal state of the diagnosis target and the target waveform is calculated. A state of the diagnosis target is determined based on the similarity.Type: ApplicationFiled: October 3, 2014Publication date: April 9, 2015Applicant: YOKOGAWA ELECTRIC CORPORATIONInventors: Tetsuya Ohtani, Hidehiko Wada, Tomohiro Kuroda
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Patent number: 8902573Abstract: A keyboard unit may comprise a keyboard body having a top face and a planar bottom face. The keyboard body may be adapted for installation in a laptop computer. The planar bottom face of the keyboard body may be disposed toward a bottom case of the laptop when installed therein. A plurality of key tops may be disposed on the top face of the keyboard body. A plurality of bosses may have end openings aligned at same plane as the planar bottom face.Type: GrantFiled: March 3, 2011Date of Patent: December 2, 2014Inventors: Fumitake Mizoguchi, Tetsuya Ohtani, Takayuki Suzuki
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Publication number: 20140254071Abstract: Devices and methods are provided for connecting device cover components. In general, the devices and methods can allow first and second covers of an electronic device to be connected together at a plurality of attachment points without any gap space between the first and second covers at the attachment points. In an exemplary embodiment, an electronic device can include a housing that has first and second covers attached to one another at a plurality of attachment points. The first cover can be formed from a first material, and the second cover can be formed from a second, different material. The first material can be a softer material than the second material, which can allow the second cover to penetrate into and deform the first cover during manufacturing of the housing such that no gap space is present between the first and second covers at each of the attachment points.Type: ApplicationFiled: March 6, 2013Publication date: September 11, 2014Applicant: LENOVO (SINGAPORE) PTE. LTD.Inventors: Akinori Uchino, Tetsuya Ohtani, Masahiro Kitamura, Tatsuya Ushioda
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Patent number: 8576372Abstract: An aspect provides a method, including: fixing a laminated panel, which has been cut into a predetermined shape, to a mold, said laminated panel having an expanded layer disposed between layers made of a conductive resin; injection of molding non-conducting resin into the mold in which the laminated panel has been fixed; wherein a non-conductive region and a conductive region are joined to form a bottom surface of a display casing, said display casing having an inner and outer surface; and wherein an antenna mounting space is formed in the non-conductive region. Other aspects are described and claimed.Type: GrantFiled: February 12, 2013Date of Patent: November 5, 2013Assignee: Lenovo (Singapore) Pte. Ltd.Inventors: Gang Ji, Tetsuya Ohtani, Takayuki Morino, Akinori Uchino
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Publication number: 20130285516Abstract: A casing for electronic equipments is disclosed. The casing includes a first region and a second region. The first region is formed by a foamed layer provided between an outer rigid layer and an inner rigid layer. The foamed layer isolates the outer rigid layer from the inner rigid layer. The second region is formed by a single layer of material, and the single layer of material is joined to the outer rigid layer, the formed layer and the inner rigid layer.Type: ApplicationFiled: March 13, 2013Publication date: October 31, 2013Applicant: LENOVO (SINGAPORE) PTE. LTD.Inventors: Fumitake Mizoguchi, Tetsuo Ogawa, Tetsuya Ohtani, Hiroaki Agata
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Publication number: 20130088825Abstract: A computer system and a detachable input unit is provided for a user to input data. A computer system may comprise a base, a linking member, and a display housing. The linking member may be pivotally connected to the base. The display housing may be pivotally attached to the linking member. The input unit may be removably attached to the linking member.Type: ApplicationFiled: October 11, 2011Publication date: April 11, 2013Inventors: FUMITAKE MIZOGUCHI, RYOTA NOHARA, TETSUYA OHTANI, RYO OTSUKA
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Patent number: 8396060Abstract: A network control system for packet-transmitting a manipulated variable (MV), calculated from a deviation between a variable from a sensor measuring a physical quantity of a controlled object plant and a set value at a known sampling period, to an actuator provided on the plant side via a network, and causing the actuator to provide the MV to the plant. The system includes: an MV complementing unit that provides a complementary value of the MV to the actuator when an error occurs in a packet transmission; an MV buffering unit that answers back trend data of the MV provided to the plant from the actuator or the complementary value being complemented by the MV compensating unit for the actuator, to the controller via the network; and an MV compensating unit that corrects a calculation of the MV of the controller based on the trend data or the complementary value being answered.Type: GrantFiled: September 29, 2008Date of Patent: March 12, 2013Assignee: Yokogawa Electric CorporationInventors: Akira Nagashima, Tetsuya Ohtani, Ryutaro Okano
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Patent number: 8379164Abstract: The invention provides a casing structure for an electronic apparatus that achieves a thin size and light weight. The casing structure is capable of accommodating a display module, and comprises a sidewall and a bottom surface in which a conductive resin region and a nonconductive resin region are butt joined in a curved line. The casing structure of the electronic apparatus does not become thick due to the butt joining even when the joint portions are in a projection area of the display module. Furthermore, on the display side of the casing structure, there is no need to have special frame members for securing strength in addition to the display casing. The display casing accommodates and protects the display module from an external pressing force and also has a design function that the outer surface of the casing resembles that of an outer surface of a conventional notebook PC.Type: GrantFiled: January 9, 2009Date of Patent: February 19, 2013Assignee: Lenovo (Singapore) Pte. LtdInventors: Gang Ji, Tetsuya Ohtani, Takayuki Morino, Akinori Uchino
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Publication number: 20120224315Abstract: A keyboard unit may comprise a keyboard body having a top face and a planar bottom face. The keyboard body may be adapted for installation in a laptop computer. The planar bottom face of the keyboard body may be disposed toward a bottom case of the laptop when installed therein. A plurality of key tops may be disposed on the top face of the keyboard body. A plurality of bosses may have end openings aligned at same plane as the planar bottom face.Type: ApplicationFiled: March 3, 2011Publication date: September 6, 2012Applicant: LENOVO (SINGAPORE) PTE. LTD.Inventors: FUMITAKE MIZOGUCHI, TETSUYA OHTANI, TAKAYUKI SUZUKI
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Publication number: 20110044331Abstract: A network control system enabling stable plant control thanks to controller compensation made in view of a packet loss. In the network control system, the amount of operation of a controller for computing the difference between the controlled variable from a sensor for measuring a physical quantity of a controlled plant and a target value is transmitted by means of a packet through a network to an actuator provided in the controlled plant, and the actuator inputs the amount of operation into the controlled plant. The network control system comprises MV complementing means for giving the actuator a complement value of the amount of operation if a packet transmission error occurs, MV buffer means for back-answering trend data on the inputted amount of operation or the complement value given to the actuator through the network to the controller, and MV compensating means for correcting the calculation of the amount of operation of the controller according to the back-answered trend data or complement value.Type: ApplicationFiled: September 29, 2008Publication date: February 24, 2011Applicant: YOKOGAWA ELECTRIC CORPORATIONInventors: Akira Nagashima, Tetsuya Ohtani, Ryutaro Okano
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Patent number: 7817093Abstract: An apparatus has an antenna distance setting mechanism that sets a distance between a cosmetic cover and a radio antenna. An upper housing and a radio antenna, which has a ground and a radiating element and is movably attached to the upper housing, are covered by a cosmetic cover formed of a dielectric material. An antenna distance setting mechanism includes a radio antenna supporting member, elastic members, and protrusions. The radio antenna-supporting member is movably attached to the upper housing. When the cosmetic cover is attached to the upper housing, an inner wall of the cosmetic cover pushes the ends of the protrusions against an elastic force of the elastic members to set the distance between the radiating element and the inner wall of the cosmetic cover to a predetermined distance.Type: GrantFiled: March 28, 2008Date of Patent: October 19, 2010Assignee: Lenovo (Singapore) Pte. Ltd.Inventors: Hiroaki Agata, Mitsuo Horiuchi, Hirohide Komiyama, Shigeki Mori, Tetsuya Ohtani, Osamu Yamamoto
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Patent number: 7755884Abstract: An apparatus for reducing weight and thickness of portable computers is disclosed. The apparatus includes a lower housing, an upper housing and a cosmetic cover. The lower housing is configured to accommodate electronic elements therein. The upper housing, which has an opening inside, includes a periphery connected to the lower housing and a main bridge structure connected from one edge of the periphery to another edge of the periphery for providing structural support to the upper housing in the opening and for accommodating a display module therein. The cosmetic cover is configured to cover the upper housing.Type: GrantFiled: January 21, 2008Date of Patent: July 13, 2010Assignee: Lenovo (Singapore) Pte. Ltd.Inventors: Mitsuo Horiuchi, Shigeki Mori, Hiroaki Agata, Yasushi Honda, Tetsuya Ohtani
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Patent number: 7595656Abstract: An interface circuit includes a driver circuit (12) made up of a combination of a plurality of transistors, a calibration circuit (14) for performing selection of on and off of one or more of the plurality of transistors for adjusting on-resistance thereof, and a terminating resistor (13) that is connected to an output side of the driver circuit (12). One or more of the transistors are turned on based on an output of the calibration circuit (14), so that a combination resistance value of the on-resistance and the terminating resistor matches characteristic impedance of the transmission line. The driver circuit (12), the calibration circuit (14) and the terminating resistor (13) are formed on the same semiconductor integrated circuit SK, and the calibration circuit (14) detects process variation and temperature variation of the transistor and the resistor formed on the semiconductor integrated circuit (SK).Type: GrantFiled: November 29, 2007Date of Patent: September 29, 2009Assignee: Fujitsu LimitedInventors: Kazunori Hayami, Tetsuya Ohtani
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Patent number: 7593837Abstract: A plant operation support system of the present invention is characterized by the following: The present invention relates to a plant operation support system which performs process simulations in parallel with operations of an actual plant and predicts operations of the actual plant on the basis of the results simulated. The plant operation support system modifies a simulation model on the basis of actual data as required, modifies the simulation model on the basis of actual data received from the actual plant, and uses the modified simulation model to perform simulations in parallel with operations of the actual plant. Accordingly, the plant operation support system can reflect plant status in the simulation model consecutively and predict operations of the actual plant in a highly accurate manner.Type: GrantFiled: March 15, 2005Date of Patent: September 22, 2009Assignee: Yokogawa Elecric Corp.Inventors: Makoto Nakaya, Gentaro Fukano, Tetsuya Ohtani, Kenji Watanabe