Abstract: To surely grasp an unlocked state of a cowl member while suppressing cost and time necessary for measures against forgetting of locking of an engine nacelle. An aircraft according to the present invention includes: an engine (3) that includes an engine main body (4, 5) outputting thrust force and an engine nacelle (7) surrounding the engine main body (4, 5); an engine pylon (2) that supports the engine main body (4, 5) to a main wing (1) and axially supports a cowl member (8) to be openable, the cowl member (8) configuring the engine nacelle (7); a locking part (30) that locks the cowl member (8) of the engine nacelle (7) in a closed state; and one or more light emitting sections (15) that are disposed inside the cowl member (8) and show an unlocked state of the cowl member (8).

Abstract: To surely grasp an unlocked state of a cowl member while suppressing cost and time necessary for measures against forgetting of locking of an engine nacelle. An aircraft according to the present invention includes: an engine (3) that includes an engine main body (4, 5) outputting thrust force and an engine nacelle (7) surrounding the engine main body (4, 5); an engine pylon (2) that supports the engine main body (4, 5) to a main wing (1) and axially supports a cowl member (8) to be openable, the cowl member (8) configuring the engine nacelle (7); a locking part (30) that locks the cowl member (8) of the engine nacelle (7) in a closed state; and one or more light emitting sections (15) that are disposed inside the cowl member (8) and show an unlocked state of the cowl member (8).

Abstract: In a method of manufacturing a surface shape recognition sensor, first and second interconnections are formed on a semiconductor substrate. An interlayer dielectric film on the semiconductor substrate covers the interconnections. A first metal film is electrically connected to the interconnections through first and second through holes in the interlayer dielectric film. A first mask pattern on the first metal film covers predetermined first and second regions corresponding to the through holes, respectively. The exposed first metal film is selectively removed to form a sensor electrode and connection electrode film, formed of the first metal film, in the first and second regions, respectively. An insulating passivation film on the interlayer dielectric film covers the sensor electrode and connection electrode film. A third through hole in the passivation film reaches the connection electrode film. A second metal film on the passivation film is in contact with the exposed connection electrode film.

Abstract: In a method of manufacturing a surface shape recognition sensor, first and second interconnections are formed on a semiconductor substrate. An interlayer dielectric film on the semiconductor substrate covers the interconnections. A first metal film is electrically connected to the interconnections through first and second through holes in the interlayer dielectric film. A first mask pattern on the first metal film covers predetermined first and second regions corresponding to the through holes, respectively. The exposed first metal film is selectively removed to form a sensor electrode and connection electrode film, formed of the first metal film, in the first and second regions, respectively. An insulating passivation film on the interlayer dielectric film covers the sensor electrode and connection electrode film. A third through hole in the passivation film reaches the connection electrode film. A second metal film on the passivation film is in contact with the exposed connection electrode film.