Patents by Inventor Tetsuya Oosawa
Tetsuya Oosawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9095064Abstract: A base insulating layer is formed on a suspension body, and write wiring traces and read wiring traces are formed on the base insulating layer. The write wiring trace and the read wiring traces are formed on a body region of the base insulating layer, and the write wiring trace is formed on an auxiliary region of the base insulating layer. The base insulating layer is bent along a bend portion. This causes the write wiring trace to be positioned above the write wiring trace.Type: GrantFiled: November 29, 2012Date of Patent: July 28, 2015Assignee: NITTO DENKO CORPORATIONInventors: Tetsuya Oosawa, Naoyuki Tanaka, Mitsuru Honjo
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Patent number: 9029708Abstract: A base insulating layer is formed on a suspension body. Read wiring patterns, write wiring patterns and a ground pattern are formed in parallel on the base insulating layer. A first cover insulating layer is formed on the base insulating layer to cover the read wiring patterns, the write wiring patterns and the ground pattern. A ground layer is formed in a region on the first cover insulating layer above the write wiring patterns. A second cover insulating layer is formed on the first cover insulating layer to cover the ground layer.Type: GrantFiled: April 14, 2011Date of Patent: May 12, 2015Assignee: Nitto Denko CorporationInventors: Tetsuya Oosawa, Mitsuru Honjo, Daisuke Yamauchi
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Publication number: 20140338958Abstract: A base insulating layer is formed on a suspension body. A lead wire for plating and a wiring trace are integrally formed on the base insulating layer. A cover insulating layer is formed on the base insulating layer to cover the lead wire for plating and the wiring trace. A thickness of a portion of the cover insulating layer above a region of the base insulating layer in which the lead wire for plating is formed is set smaller than the thickness of a portion of the cover insulating layer above other regions of the base insulating layer.Type: ApplicationFiled: July 31, 2014Publication date: November 20, 2014Inventors: Daisuke YAMAUCHI, Tetsuya OOSAWA, Mitsuru HONJO, Masami INOUE
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Patent number: 8853546Abstract: A base insulating layer is formed on a suspension body. A lead wire for plating and a wiring trace are integrally formed on the base insulating layer. A cover insulating layer is formed on the base insulating layer to cover the lead wire for plating and the wiring trace. A thickness of a portion of the cover insulating layer above a region of the base insulating layer in which the lead wire for plating is formed is set smaller than the thickness of a portion of the cover insulating layer above other regions of the base insulating layer.Type: GrantFiled: July 16, 2010Date of Patent: October 7, 2014Assignee: Nitto Denko CorporationInventors: Daisuke Yamauchi, Tetsuya Oosawa, Mitsuru Honjo, Masami Inoue
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Patent number: 8350159Abstract: A base insulating layer is formed on a suspension body, and write wiring traces and read wiring traces are formed on the base insulating layer. The write wiring trace and the read wiring traces are formed on a body region of the base insulating layer, and the write wiring trace is formed on an auxiliary region of the base insulating layer. The base insulating layer is bent along a bend portion. This causes the write wiring trace to be positioned above the write wiring trace.Type: GrantFiled: March 25, 2010Date of Patent: January 8, 2013Assignee: Nitto Denko CorporationInventors: Tetsuya Oosawa, Naoyuki Tanaka, Mitsuru Honjo
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Publication number: 20110259632Abstract: A base insulating layer is formed on a suspension body. Read wiring patterns, write wiring patterns and a ground pattern are formed in parallel on the base insulating layer. A first cover insulating layer is formed on the base insulating layer to cover the read wiring patterns, the write wiring patterns and the ground pattern. A ground layer is formed in a region on the first cover insulating layer above the write wiring patterns. A second cover insulating layer is formed on the first cover insulating layer to cover the ground layer.Type: ApplicationFiled: April 14, 2011Publication date: October 27, 2011Applicant: NITTO DENKO CORPORATIONInventors: Tetsuya OOSAWA, Mitsuru HONJO, Daisuke YAMAUCHI
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Publication number: 20110011626Abstract: A base insulating layer is formed on a suspension body. A lead wire for plating and a wiring trace are integrally formed on the base insulating layer. A cover insulating layer is formed on the base insulating layer to cover the lead wire for plating and the wiring trace. A thickness of a portion of the cover insulating layer above a region of the base insulating layer in which the lead wire for plating is formed is set smaller than the thickness of a portion of the cover insulating layer above other regions of the base insulating layer.Type: ApplicationFiled: July 16, 2010Publication date: January 20, 2011Applicant: NITTO DENKO CORPORATIONInventors: Daisuke YAMAUCHI, Tetsuya OOSAWA, Mitsuru HONJO, Masami INOUE
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Patent number: 7866930Abstract: In a bolt of the present invention, a guide portion having a small diameter is formed at the distal end of a shaft portion and ridge having an inverted direction screw configuration relative to the ridge formed on a constant diameter portion is formed. When the bolt is inserted obliquely into a nut and the ridge gets into engagement with a female screw portion of the nut, an effect of floating the bolt is generated, and the bolt cannot be driven into the nut unless it is set in an appropriate tightening posture. Consequently, biting and seizing of the bolt to the nut can be prevented securely. If the ridge is formed into a double threaded screw having an inverted direction screw configuration, the effect can be further intensified.Type: GrantFiled: June 13, 2005Date of Patent: January 11, 2011Assignee: Aoyama Seisakusho Co., Ltd.Inventors: Yoshihiro Murase, Tetsuya Oosawa, Mitsuru Kozawa, Sadayoshi Hasegawa
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Publication number: 20100243297Abstract: A base insulating layer is formed on a suspension body, and write wiring traces and read wiring traces are formed on the base insulating layer. The write wiring trace and the read wiring traces are formed on a body region of the base insulating layer, and the write wiring trace is formed on an auxiliary region of the base insulating layer. The base insulating layer is bent along a bend portion. This causes the write wiring trace to be positioned above the write wiring trace.Type: ApplicationFiled: March 25, 2010Publication date: September 30, 2010Applicant: NITTO DENKO CORPORATIONInventors: Tetsuya OOSAWA, Naoyuki TANAKA, Mitsuru HONJO
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Publication number: 20090060676Abstract: In a bolt of the present invention, a guide portion (116) having a small diameter is formed at the distal end of a shaft portion (15) and ridge (31) having an inverted direction screw configuration relative to the ridge (30) formed on a constant diameter portion (115) is formed. When the bolt (1) is inserted obliquely into a nut (100) and the ridge (31) gets into engagement with a female screw portion (105) of the nut (100), an effect of floating the bolt (1) is generated, and the bolt 1 cannot be driven into the nut 100 unless it is set in an appropriate tightening posture. Consequently, biting and seizing of the bolt 1 to the nut can be prevented securely. If the ridge (31) is formed into a double threaded screw having an inverted direction screw configuration, the effect can be further intensified.Type: ApplicationFiled: June 13, 2005Publication date: March 5, 2009Applicant: Aoyama Seisakusho Co., Ltd.Inventors: Yoshihiro Murase, Tetsuya Oosawa, Mitsuru Kozawa, Sadayoshi Hasegawa
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Patent number: 7336446Abstract: A suspension board with circuit having a conductor layer formed in the form of a fine wiring circuit by an additive process, while providing a reduced risk of damage and breaking of the conductor layer in a flying lead portion. The suspension board with circuit comprises a supporting board 2, an insulating base layer 3 formed on the supporting board 2, a conductor layer 4 formed on the insulating base layer 3, an insulating cover layer 5 formed on the conductor layer 4, and a flying lead portion 9 in which a supporting-board-side opening 13, a base-layer-side opening 14, and a cover-layer-side opening 15 are formed so that both sides of the conductor layer 4 can be exposed therefrom. A reinforcing portion 16 or 23 for reinforcing the conductor layer 4 formed continuously from at least either of the insulating base layer 3 and the insulating cover layer 5 along the longitudinal direction of the conductor layer 4 is included in the flying lead portion 9.Type: GrantFiled: December 3, 2004Date of Patent: February 26, 2008Assignee: Nitto Denko CorporationInventors: Hitoki Kanagawa, Yasuhito Funada, Tetsuya Oosawa
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Publication number: 20050122627Abstract: A suspension board with circuit having a conductor layer formed in the form of a fine wiring circuit by an additive process, while providing a reduced risk of damage and breaking of the conductor layer in a flying lead portion. The suspension board with circuit comprises a supporting board 2, an insulating base layer 3 formed on the supporting board 2, a conductor layer 4 formed on the insulating base layer 3, an insulating cover layer 5 formed on the conductor layer 4, and a flying lead portion 9 in which a supporting-board-side opening 13, a base-layer-side opening 14, and a cover-layer-side opening 15 are formed so that both sides of the conductor layer 4 can be exposed therefrom. A reinforcing portion 16 or 23 for reinforcing the conductor layer 4 formed continuously from at least either of the insulating base layer 3 and the insulating cover layer 5 along the longitudinal direction of the conductor layer 4 is included in the flying lead portion 9.Type: ApplicationFiled: December 3, 2004Publication date: June 9, 2005Inventors: Hitoki Kanagawa, Yasuhito Funada, Tetsuya Oosawa
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Publication number: 20020104092Abstract: In on-demand distribution, suitable image information corresponding to a receiver terminal and a distribution line is distributed and, even when a user uses a plurality of receiver terminals, distribution can be interrupted and resumed. By selecting and/or processing resolution information, advertisement image information, text information, and reproduction time information of the received-image information based on information relating to a receiver terminal and information relating to a distribution line provided separately, an image distribution apparatus distributes suitable image information corresponding to the receiver terminal and distribution line. When the distribution was interrupted, the apparatus stores a break point at which the distribution was interrupted for each user.Type: ApplicationFiled: March 30, 2001Publication date: August 1, 2002Inventors: Hideo Arai, Takashi Nishimura, Tetsuya Oosawa, Akira Motosu