Patents by Inventor Tetsuya Osawa

Tetsuya Osawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7132607
    Abstract: A wired circuit board is provided having enhanced reliability of electrical connection between a metal substrate and a shield layer to achieve significant noise reduction reliably. An insulating base layer is formed on the metal substrate, while resin layers are formed on the metal substrate with a predetermined space provided from the both widthwise sides of the insulating base layer. A conductor layer is formed having a predetermined wired circuit pattern on the insulating base layer. Thereafter, an insulating cover layer is formed on the insulating base layer in such a manner as to cover the conductor layer. Then, a shield layer is laminated on the metal substrate to cover the insulating cover layer and also is put in close contact with the resin layers at end portions thereof by a vacuum film-forming method or by plating.
    Type: Grant
    Filed: June 4, 2004
    Date of Patent: November 7, 2006
    Assignee: Nitto Denko Corporation
    Inventors: Takeshi Yoshimi, Tetsuya Osawa
  • Publication number: 20040245015
    Abstract: To provide a wired circuit board that can provide enhanced reliability of electrical connection between a metal substrate and a shield layer to achieve significant noise reduction reliably, an insulating base layer 3 is formed on the metal substrate 2 while resin layers 7 are formed on the metal substrate 2 with a predetermined space from away from the both widthwise sides of the insulating base layer 3. Then, a conductor layer 4 is formed in the form of a predetermined wired circuit pattern on the insulating base layer 3. Thereafter, an insulating cover layer 5 is formed on the insulating base layer 3 in such a manner as to cover the conductor layer 4. Then, a shield layer 6 is laminated on the metal substrate 2 in such a relation that it covers the insulating cover layer 5 and also is put in close contact with the resin layers 7 at end portions thereof by a vacuum film-forming method or by plating.
    Type: Application
    Filed: June 4, 2004
    Publication date: December 9, 2004
    Inventors: Takeshi Yoshimi, Tetsuya Osawa
  • Patent number: 6796761
    Abstract: A bolt is provided with a head part and a shank part. The shank part includes a first constant diameter cylindrical part, a transition part, a cylindrical connection part, and a second constant diameter cylindrical part concentrically extending from the first constant diameter cylindrical part to the second constant diameter cylindrical part. The first constant diameter cylindrical part has a screw thread with a predetermined pitch formed on the side surface thereof. The transition part has a tapered shape and has a screw thread with a predetermined pitch formed on the side surface thereof. The cylindrical connection part has a diameter smaller than that of the first constant diameter part. The second constant diameter cylindrical part has a diameter smaller than the first constant diameter part, and has a screw thread with a predetermined pitch formed on the side surface thereof. The crest part of the screw thread formed on the side surface of the transition part is truncated.
    Type: Grant
    Filed: September 24, 2002
    Date of Patent: September 28, 2004
    Assignee: Aoyama Seisakusho Co., Ltd.
    Inventors: Hiromichi Mizuno, Masahiko Hamada, Tetsuya Osawa, Kazuhiro Aoyama, Mitsuru Kozawa
  • Publication number: 20030059275
    Abstract: An object of the present invention is to provide a bolt and a nut capable of appropriately adjusting the orientation of the bolt and fastening the bolt and the nut without fastening defects such as slipping and seizure even when the bolt is obliquely inserted into the nut.
    Type: Application
    Filed: September 24, 2002
    Publication date: March 27, 2003
    Applicant: AOYAMA SEISAKUSHO CO., LTD.
    Inventors: Hiromichi Mizuno, Masahiko Hamada, Tetsuya Osawa, Kazuhiro Aoyama, Mitsuru Kozawa
  • Patent number: 5387118
    Abstract: A socket for an IC package includes a base member having a receptacle space for the IC package, a plurality of contacts arranged in parallel along the sides of the receptacle space of the base member. The contacts each have a contact portion for contact with a corresponding lead of the IC package received in the receptacle space. A spring portion urges the contact portion inwardly to obtain a contact pressure against a lead. A connecting shaft is pivotally supported vertically along each row of the contacts, and is associated with the contacts. A cover covers the base member, and the connecting shaft pivots by depression of the cover to displace the contact portion of each contact outwardly away from the corresponding lead of the IC package against a biasing force of the spring portion. The contact has a curved, first spring portion extending upwardly and inwardly from an inside edge of a plate portion.
    Type: Grant
    Filed: August 10, 1993
    Date of Patent: February 7, 1995
    Assignee: Chichibu Fuji Co., Ltd.
    Inventors: Nobuaki Kishi, Makoto Hoshi, Tetsuya Osawa, Ichiro Matsuo