Patents by Inventor Tetsuya Oshita

Tetsuya Oshita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer holding ring for chemical and mechanical polisher
    Patent number: 6896602
    Abstract: Disclosed is a wafer-holding ring adapted for holding a wafer on a chemical mechanical polishing apparatus, which can prevent damage to a wafer, possesses excellent abrasion resistance, and can reduce replacement work and consequently can realize mass production of polished wafers. In the wafer-holding ring for a chemical mechanical polishing apparatus, the surface of the wafer-holding ring at least in its portion, which can come into contact with a wafer, is formed of a resin composition comprising not less than 30% by weight of polybenzimidazole.
    Type: Grant
    Filed: May 8, 2002
    Date of Patent: May 24, 2005
    Assignee: Clariant Finance (BVI) Limited
    Inventors: Tetsuya Oshita, Masami Aizawa, Katsuyuki Sakamoto
  • Wafer holding ring for checmial and mechanical polisher
    Publication number: 20040023609
    Abstract: Disclosed is a wafer-holding ring adapted for holding a wafer on a chemical mechanical polishing apparatus, which can prevent damage to a wafer, possesses excellent abrasion resistance, and can reduce replacement work and consequently can realize mass production of polished wafers. In the wafer-holding ring for a chemical mechanical polishing apparatus, the surface of the wafer-holding ring at least in its portion, which can come into contact with a wafer, is formed of a resin composition comprising not less than 30% by weight of polybenzimidazole.
    Type: Application
    Filed: April 4, 2003
    Publication date: February 5, 2004
    Inventors: Tetsuya Oshita, Masami Aizawa, Katsuyuki Sakamoto