Patents by Inventor Tetsuya Otsuka
Tetsuya Otsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11951729Abstract: A laminated sheet includes a first porous layer including a plurality of fibers of at least one of inorganic fiber or carbonized fiber; and a second porous layer formed of a plurality of organic fibers, wherein the laminated sheet has a surface density of greater than or equal to 400 g/m2 and less than or equal to 1550 g/m2, wherein the second porous layer is formed of the plurality of organic fibers having a mean diameter of fibers being greater than or equal to 0.5 ?m and less than or equal to 14 ?m, and wherein, expressing a total volume of solids and voids filling a unit volume of the second porous layer as 100%, a percentage of the solids is greater than or equal to 1.0% and less than or equal to 8.0%.Type: GrantFiled: May 30, 2019Date of Patent: April 9, 2024Assignee: NITTO DENKO CORPORATIONInventors: Shigeki Ishiguro, Kayo Shimokawa, Tetsuya Otsuka, Hidetoshi Maikawa
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Publication number: 20230357523Abstract: A composite material includes a matrix and a heat-conductive fiber. The matrix includes an organic polymer and forms a porous structure. The heat-conductive fiber is fixed in the porous structure by the matrix. A heat conductivity determined at ordinary temperature by a steady state heat flow method in a fiber axis direction of the heat-conductive fiber is 10 W/(m·K) or more. A density d [g/cm3] of the composite material and a heat conductivity ? [W/(m·K)] in a given direction of the composite material satisfy requirements d?1.1, ?>1, and 4??/d?100.Type: ApplicationFiled: June 28, 2021Publication date: November 9, 2023Inventors: Takanobu MIMURA, Tetsuya OTSUKA
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Publication number: 20230159811Abstract: A composite material according to the present invention includes a solid portion including inorganic particles and a resin. The composite material has a porous structure including a plurality of voids surrounded by the solid portion. The composite material compressed by 10% has a reaction force of 0.1 kPa to 1000 kPa, and the composite material has a heat conductivity of 0.5 W/(m·K) or more. The heat conductivity is a value measured for one test specimen in a symmetric configuration according to an American Society for Testing and Materials (ASTM) standard (ASTM) D5470-01.Type: ApplicationFiled: March 30, 2021Publication date: May 25, 2023Inventors: Tetsuya OTSUKA, Takanobu MIMURA, Tomoya KATO
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Publication number: 20230135684Abstract: A composite material according to the present invention includes a solid portion including inorganic particles and a resin. The composite material has a porous structure including a plurality of voids surrounded by the solid portion. In the composite material, a value P1 determined by the following equation (1) is 6 or more. In the equation (1), a heat conductivity is a value measured for one test specimen in a symmetric configuration according to an American Society for Testing and Materials (ASTM) standard D5470-01. P1=(the heat conductivity [W/(m·K)] of the composite material/an amount[volume %] of the inorganic particles)×100 Equation (1).Type: ApplicationFiled: March 30, 2021Publication date: May 4, 2023Inventors: Tetsuya OTSUKA, Takanobu MIMURA, Tomoya KATO
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Publication number: 20230137782Abstract: A composite material according to the present invention includes a solid portion including inorganic particles and a resin. The composite material has a porous structure including a plurality of voids surrounded by the solid portion. In the composite material, a ratio of a smallest heat conductivity of heat conductivities ?x, ?y, and ?z respectively in x-axis, y-axis, and z-axis directions perpendicular to each other to a largest heat conductivity of the heat conductivities ?x, ?y, and ?z is 0.8 or more.Type: ApplicationFiled: March 30, 2021Publication date: May 4, 2023Inventors: Tetsuya OTSUKA, Takanobu MIMURA, Tomoya KATO
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Publication number: 20230131295Abstract: A composite material according to the present invention includes a solid portion including inorganic particles and a resin. The composite material has a porous structure including a plurality of voids surrounded by the solid portion. The composite material has a heat conductivity of 0.5 W/(m·K) or more and a spring constant of 100 N/m to 70,000 N/m. The heat conductivity is a value measured for one test specimen in a symmetric configuration according to an American Society for Testing and Materials (ASTM) standard D5470-01.Type: ApplicationFiled: March 30, 2021Publication date: April 27, 2023Inventors: Tetsuya OTSUKA, Takanobu MIMURA, Tomoya KATO
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Publication number: 20230126034Abstract: A composite material according to the present invention includes a solid portion including inorganic particles and a resin. The composite material has a porous structure including a plurality of voids surrounded by the solid portion. The composite material satisfies (i) and/or (ii). (i) P2 is 500 or more. (ii) The composite material has a heat conductivity of 0.5 W/(m·K) or more and a thickness of 0.5 mm to 2.5 mm, the void have an average diameter of 50 ?m to 1500 ?m, and P3 is 70% to 90%.Type: ApplicationFiled: March 30, 2021Publication date: April 27, 2023Inventors: Tetsuya OTSUKA, Takanobu MIMURA, Tomoya KATO
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Publication number: 20230124486Abstract: A composite material according to the present invention includes a solid portion including inorganic particles and a resin. The composite material has a porous structure including a plurality of voids facing a wall surface of the solid portion. At least a portion of the inorganic particles is present on a wall surface. The plurality of voids are in contact with each other directly or via the inorganic particle. A heat transmission path stretching through the plurality of voids is formed of the inorganic particles in contact with each other.Type: ApplicationFiled: March 30, 2021Publication date: April 20, 2023Inventors: Tetsuya OTSUKA, Takanobu MIMURA, Tomoya KATO
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Patent number: 11270680Abstract: A soundproof structure includes a porous fibrous body that attenuates incident sound waves, wherein the fibrous body is formed of fibers having an average fiber diameter of 0.5 ?m or more and 5 ?m or less, and includes a surface layer on which the sound waves are incident and a propagation layer that is stacked with the surface layer and that propagates the sound waves from the surface layer, and wherein the propagation layer includes a high density layer having a density higher than a density of the surface layer.Type: GrantFiled: April 16, 2019Date of Patent: March 8, 2022Assignee: Nitto Denko CorporationInventors: Tetsuya Otsuka, Naoto Hayashi, Takeshi Sutou
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Publication number: 20210237396Abstract: A laminated sheet includes a first porous layer including a plurality of fibers of at least one of inorganic fiber or carbonized fiber; and a second porous layer formed of a plurality of organic fibers, wherein the laminated sheet has a surface density of greater than or equal to 400 g/m2 and less than or equal to 1550 g/m2, wherein the second porous layer is formed of the plurality of organic fibers having a mean diameter of fibers being greater than or equal to 0.5 ?m and less than or equal to 14 ?m, and wherein, expressing a total volume of solids and voids filling a unit volume of the second porous layer as 100%, a percentage of the solids is greater than or equal to 1.0% and less than or equal to 8.0%.Type: ApplicationFiled: May 30, 2019Publication date: August 5, 2021Inventors: Shigeki ISHIGURO, Kayo SHIMOKAWA, Tetsuya OTSUKA, Hidetoshi MAIKAWA
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Publication number: 20210035546Abstract: This porous fiber sheet is formed using fibers having an average fiber diameter of 0.5 ?m to 20 ?m. If the total volume of solid and gap per unit volume is 100%, the percentage of solid is 1.3% to 8%.Type: ApplicationFiled: October 23, 2018Publication date: February 4, 2021Inventors: Tetsuya OTSUKA, Hidetoshi MAIKAWA, Shigeki ISHIGURO
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Publication number: 20190244598Abstract: A soundproof structure includes a porous fibrous body that attenuates incident sound waves, wherein the fibrous body is formed of fibers having an average fiber diameter of 0.5 ?m or more and 5 ?m or less, and includes a surface layer on which the sound waves are incident and a propagation layer that is stacked with the surface layer and that propagates the sound waves from the surface layer, and wherein the propagation layer includes a high density layer having a density higher than a density of the surface layer.Type: ApplicationFiled: April 16, 2019Publication date: August 8, 2019Inventors: Tetsuya OTSUKA, Naoto HAYASHI, Takeshi SUTOU
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Patent number: 10105929Abstract: A foamed sheet according to the present invention has a thickness of 30 to 500 ?m and includes a foam. The foam has a density of 0.2 to 0.7 g/cm3, an average cell diameter of 10 to 150 ?m, and a peak top of loss tangent (tan ?) occurring in a temperature range of from ?30° C. to 30° C., where the loss tangent is defined as the ratio of a loss modulus to a storage modulus determined at an angular frequency of 1 rad/s in dynamic viscoelastic measurement of the foam. The foam preferably has a maximum of the loss tangent (tan ?) in the temperature range of from ?30° C. to 30° C. of 0.2 or more.Type: GrantFiled: August 21, 2014Date of Patent: October 23, 2018Assignee: NITTO DENKO CORPORATIONInventors: Kohei Doi, Kunio Nagasaki, Tetsuya Otsuka, Mika Okada, Kazumichi Kato, Hideyuki Tokuyama, Tsunaki Kitahara, Tadao Takahashi, Kiichiro Matsushita
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Publication number: 20170121481Abstract: Provided is a resin foam (13) that highly restrains the occurrence of display irregularities in a display unit when the resin foam is used in a touch-screen-equipped device (1), where the display irregularities may occur with user's touch operations. The resin foam (13) according to the present invention is obtained by expansion of a resin composition including a resin. The resin foam has a 25% compression load of 0.1 N/cm2 to 8.0 N/cm2 and is used in the touch-screen-equipped device (1). The resin is preferably at least one resin selected from the group consisting of polyolefin resins, polyester resins, and acrylic resins.Type: ApplicationFiled: March 12, 2015Publication date: May 4, 2017Applicant: NITTO DENKO CORPORATIONInventors: Itsuhiro HATANAKA, Tetsuya OTSUKA, Yusuke YAMANARI, Hiroyuki SUZUKI, Kazumichi KATO, Kohei DOI
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Publication number: 20160221299Abstract: A foamed sheet according to the present invention has a thickness of 30 to 500 ?m and includes a foam. The foam has a density of 0.2 to 0.7 g/cm3, an average cell diameter of 10 to 150 ?m, and a peak top of loss tangent (tan ?) occurring in a temperature range of from ?30° C. to 30° C., where the loss tangent is defined as the ratio of a loss modulus to a storage modulus determined at an angular frequency of 1 rad/s in dynamic viscoelastic measurement of the foam. The foam preferably has a maximum of the loss tangent (tan ?) in the temperature range of from ?30° C. to 30° C. of 0.2 or more.Type: ApplicationFiled: August 21, 2014Publication date: August 4, 2016Applicant: NITTO DENKO CORPORATIONInventors: Kohei DOI, Kunio NAGASAKI, Tetsuya OTSUKA, Mika OKADA, Kazumichi KATO, Hideyuki TOKUYAMA, Tsunaki KITAHARA, Tadao TAKAHASHI, Kiichiro MATSUSHITA
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Publication number: 20130004767Abstract: Provided is an electroconductive pressure-sensitive adhesive tape which can exhibit stable electrical conductivity even when used over a long duration and/or used under severe environmental conditions. The electroconductive pressure-sensitive adhesive tape has a metallic foil and, on one side thereof, a pressure-sensitive adhesive layer, in which the electroconductive pressure-sensitive adhesive tape has a maximum resistance in the first cycle of 1 ? or less and has a maximum resistance in the 200th cycle being 5 times or less the maximum resistance in the first cycle, as measured in a thermo-cycle test.Type: ApplicationFiled: February 28, 2011Publication date: January 3, 2013Applicant: NITTO DENKO CORPORATIONInventors: Noritsugu Daigaku, Kota Nakao, Ai Murakami, Takahiro Nonaka, Hironori Tamai, Yasushi Buzoujima, Shinya Nakano, Shinatarou Taira, Tetsuya Otsuka
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Patent number: 7321375Abstract: In a color thermal printer, a thermal head has an array of heating elements, arranged in a main scan direction, for thermal recording to respectively pixels on thermosensitive recording material. The recording material is moved relative to the thermal head in a sub scan direction crosswise to the main scan direction, to record an image to the recording material according to image data. The recording material includes two lateral edges, opposed to each other, for extending in the sub scan direction. In the thermal printer, the image is recorded in a region extending to the two lateral edges on the recording material according to the image data. Density of two edge portions of the image disposed along the two lateral edges are lowered by processing the image data, to prevent occurrence of scorch on the two lateral edges.Type: GrantFiled: July 22, 2005Date of Patent: January 22, 2008Assignee: FUJIFILM CorporationInventors: Hiroyuki Otaka, Tetsuya Otsuka
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Patent number: 7061516Abstract: In a color thermal printer, a thermal head has an array of heating elements, arranged in a main scan direction, for thermal recording to respectively pixels on thermosensitive recording material. The recording material is moved relative to the thermal head in a sub scan direction crosswise to the main scan direction, to record an image to the recording material according to image data. The recording material includes two lateral edges, opposed to each other, for extending in the sub scan direction. In the thermal printer, the image is recorded in a region extending to the two lateral edges on the recording material according to the image data. Density of two edge portions of the image disposed along the two lateral edges are lowered by processing the image data, to prevent occurrence of scorch on the two lateral edges.Type: GrantFiled: October 21, 2003Date of Patent: June 13, 2006Assignee: Fuji Photo Film Co., Ltd.Inventors: Hiroyuki Otaka, Tetsuya Otsuka
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Publication number: 20050253919Abstract: In a color thermal printer, a thermal head has an array of heating elements, arranged in a main scan direction, for thermal recording to respectively pixels on thermosensitive recording material. The recording material is moved relative to the thermal head in a sub scan direction crosswise to the main scan direction, to record an image to the recording material according to image data. The recording material includes two lateral edges, opposed to each other, for extending in the sub scan direction. In the thermal printer, the image is recorded in a region extending to the two lateral edges on the recording material according to the image data. Density of two edge portions of the image disposed along the two lateral edges are lowered by processing the image data, to prevent occurrence of scorch on the two lateral edges.Type: ApplicationFiled: July 22, 2005Publication date: November 17, 2005Inventors: Hiroyuki Otaka, Tetsuya Otsuka
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Publication number: 20040097780Abstract: A new cartridge for a marker delivery device used in radiotherapy is provided. The cartridge has a transparent cartridge body that holds the marker inside it and permits external visual observation of the marker, and has an outer tube that is fitted on an outer circumference of the cartridge body, the outer tube is slidable in the longitudinal direction of the cartridge body, with this outer tube's sliding the cartridge body is exposable. The marker delivery device is suitable for implanting the marker in a flexible coil shape, made of X-ray-opaque or ultrasonic-wave opaque metal into the human body. And the cartridge of the device is capable of implanting a coil-shaped marker long enough in size compared with that of tissues, which permits, in marker-assisted ultrasonic imaging, to assess the size of the tissues accurately.Type: ApplicationFiled: November 12, 2003Publication date: May 20, 2004Applicant: KAWASUMI LABORATORIES, INC.Inventor: Tetsuya Otsuka