Patents by Inventor Tetsuya Shirazu

Tetsuya Shirazu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for fabricating semiconductor device
    Patent number: 8286344
    Abstract: A method for fabricating a semiconductor device includes (a) depositing an insulating film on a semiconductor substrate; (b) forming a recess in the insulating film; (c) depositing a conductive film on the insulating film while filling the recess with the conductive film; and (d) polishing the conductive film. Step (d) includes a first polishing substep of using a first polisher pad conditioned with a first dresser and a second polishing substep of using a second polisher pad conditioned with a second dresser different from the first dresser.
    Type: Grant
    Filed: August 28, 2008
    Date of Patent: October 16, 2012
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Manabu Sakamoto, Tetsuya Shirazu, Naoki Idani