Patents by Inventor Tetsuya Takeoka

Tetsuya Takeoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Clip-type lead frame for electrically connecting two substrates or devices
    Patent number: 6688892
    Abstract: A subject of the present invention is to provide a clip-type lead frame having flexibility against a board thickness variation caused by not only an uneven product quality but also several different thick type products. To this end, the provided clip-type lead frame has a height adjustable means at lead pins corresponding to upper or/and lower side connection pads of the semiconductor device or the sub-board.
    Type: Grant
    Filed: July 25, 2002
    Date of Patent: February 10, 2004
    Assignee: Renesas Technology Corp.
    Inventors: Takakazu Fukumoto, Hajime Maeda, Tetsuya Takeoka
  • Clip-type lead frame for electrically connecting two substrates or devices
    Publication number: 20030119340
    Abstract: A subject of the present invention is to provide a clip-type lead frame having flexibility against a board thickness variation caused by not only an uneven product quality but also several different thick type products. To this end, the provided clip-type lead frame has a height adjustable means at lead pins corresponding to upper or/and lower side connection pads of the semiconductor device or the sub-board.
    Type: Application
    Filed: July 25, 2002
    Publication date: June 26, 2003
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Takakazu Fukumoto, Hajime Maeda, Tetsuya Takeoka