Abstract: The method of manufacturing a semiconductor device according to the embodiment includes a step of performing cleaning. The cleaning step includes a step of preparing a cleaning apparatus having a first rotation mechanism including a first motor, a second rotation mechanism including a second motor, a second central shaft, and a cylindrical roller brush including an outer peripheral surface; a step of rotating the semiconductor wafer around the first central axis by the first rotation mechanism; and a step of rotating the roller brush around the second central axis by the second rotation mechanism and contacting the outer peripheral surface with the surface. An abnormality in the cleaning step is detected based on the current output from the second motor.