Patents by Inventor Tetsuya Utsunomiya

Tetsuya Utsunomiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Probe card assembly and method of manufacturing probe card assembly
    Patent number: 5521523
    Abstract: A probe card assembly thermal influenced from a wafer with which a probe makes contact during a probe test. The assembly includes a probe card unit having a great number of probes to be brought into contact with the wafer to be tested, and a holder for holding the probe card unit at a center portion thereof. The holder includes a ring member, supported by another member, for supporting the probe card unit from a low side, and a cutout stepped member and a slot hole for relaxing stress due to thermal expansion concentrated on the ring member.
    Type: Grant
    Filed: December 14, 1993
    Date of Patent: May 28, 1996
    Assignees: Tokyo Electron Limited, Tokyo Electron Yamanashi Limited
    Inventors: Hidetoshi Kimura, Tetsuya Utsunomiya, Chiaki Mochizuki