Patents by Inventor Tetsuya YADA

Tetsuya YADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Communication device, non-transitory computer-readable recording medium storing computer-readable instructions for communication device, and method performed by communication device
    Patent number: 11972270
    Abstract: A communication device may include: a memory configured to store management information in which, for each of a plurality of OIDs of a MIB, the OID and a setting value are associated with each other; and a controller, wherein the controller may be configured to: receive a setting command which conforms to TCP; write the setting value included in the setting command to the management information in association with the OID included in the setting command; and send a response command which conforms to the TCP. In a case where the setting command including a first OID and a first setting value is received, the controller may be configured to: write the first setting value to the management information in association with the first OID after the response command has been sent, and send the response command before the first setting value is written to the management information.
    Type: Grant
    Filed: July 27, 2023
    Date of Patent: April 30, 2024
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Koki Izumi, Satoshi Matsushita, Satoru Yanagi, Munehisa Matsuda, Kiyotaka Ohara, Katsunori Enomoto, Yuki Yada, Kyohei Mori, Hideki Nogawa, Tetsuya Okuno
  • Contact
    Patent number: 11646512
    Abstract: [Object] To provide a contact that can hold down effects caused by solder, even if an elastic contacting portion is extending from a location contacting a first member. [Solving means] The contact includes a base portion, an elastic contacting portion and a gap forming portion. The base portion is configured solderable on a component mounting surface of the first member. The elastic contacting portion is configured elastically deformable and relatively swingable with respect to the base portion, and when contacting a contacted surface of the second member, is configured to elastically deform to be in pressurized contact with the contacted surface.
    Type: Grant
    Filed: May 20, 2019
    Date of Patent: May 9, 2023
    Assignee: KITAGAWA INDUSTRIES CO., LTD.
    Inventors: Tetsuya Yada, Tatsuya Nakamura
  • CONTACT
    Publication number: 20220006210
    Abstract: [Object] To provide a contact that can hold down effects caused by solder, even if an elastic contacting portion is extending from a location contacting a first member. [Solving means] The contact includes a base portion, an elastic contacting portion and a gap forming portion. The base portion is configured solderable on a component mounting surface of the first member. The elastic contacting portion is configured elastically deformable and relatively swingable with respect to the base portion, and when contacting a contacted surface of the second member, is configured to elastically deform to be in pressurized contact with the contacted surface.
    Type: Application
    Filed: May 20, 2019
    Publication date: January 6, 2022
    Inventors: Tetsuya YADA, Tatsuya NAKAMURA