Patents by Inventor Tetsuya Yashima
Tetsuya Yashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11869788Abstract: A substrate processing apparatus includes a first processing unit and a second processing unit placed in upper and lower two stages. Each processing unit has: a plurality of processing tanks arranged in series; a partition wall defining a conveyance space extending along an arrangement direction outside the plurality of processing tanks; a conveyance mechanism placed in the conveyance space and being configured to convey a substrate between the processing tanks along the arrangement direction; and an air guide duct provided to extend along the arrangement direction in the conveyance space. The air guide duct is connected with a fan filter unit. Each of the processing tanks is connected with an exhaust duct. An opening is formed in each of parts facing the processing tank in the air guide duct. The conveyance spaces of the first and second processing units are separated into upper and lower segments by the partition wall.Type: GrantFiled: August 9, 2018Date of Patent: January 9, 2024Assignee: EBARA CORPORATIONInventors: Koji Maeda, Mitsuhiko Inaba, Haiyang Xu, Tetsuya Yashima
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Publication number: 20200388510Abstract: A substrate processing apparatus includes a first processing unit and a second processing unit placed in upper and lower two stages. Each processing unit has: a plurality of processing tanks arranged in series; a partition wall defining a conveyance space extending along an arrangement direction outside the plurality of processing tanks; a conveyance mechanism placed in the conveyance space and being configured to convey a substrate between the processing tanks along the arrangement direction; and an air guide duct provided to extend along the arrangement direction in the conveyance space. The air guide duct is connected with a fan filter unit. Each of the processing tanks is connected with an exhaust duct. An opening is formed in each of parts facing the processing tank in the air guide duct. The conveyance spaces of the first and second processing units are separated into upper and lower segments by the partition wall.Type: ApplicationFiled: August 9, 2018Publication date: December 10, 2020Inventors: Koji MAEDA, Mitsuhiko INABA, Haiyang XU, Tetsuya YASHIMA
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Patent number: 10688622Abstract: A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.Type: GrantFiled: June 6, 2017Date of Patent: June 23, 2020Assignee: Ebara CorporationInventors: Hiroshi Aono, Kuniaki Yamaguchi, Hiroshi Shimomoto, Koji Maeda, Tetsuya Yashima, Kenji Shinkai, Koichi Hashimoto, Mitsuhiko Inaba, Hidetatsu Isokawa, Hidetaka Nakao, Soichi Isobe
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Patent number: 10573509Abstract: The cleaning apparatus includes multiple kinds of cleaning modules each configured to perform a cleaning processing of a substrate, a first accommodating section configured to accommodate the multiple kinds of cleaning modules therein, and a fluid supply section configured to supply a fluid to the cleaning modules accommodated in the first accommodating section through a pipe. Each of the multiple kinds of cleaning modules includes a pipe connection portion having a common connection position to be connected with the pipe.Type: GrantFiled: June 23, 2017Date of Patent: February 25, 2020Assignee: Ebara CorporationInventors: Koji Maeda, Hiroshi Shimomoto, Kuniaki Yamaguchi, Hiroshi Aono, Tetsuya Yashima, Hidetatsu Isokawa, Kenji Shinkai, Mitsuhiko Inaba, Koichi Hashimoto, Junji Kunisawa, Mitsuru Miyazaki, Fujihiko Toyomasu
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Publication number: 20180001440Abstract: A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.Type: ApplicationFiled: June 6, 2017Publication date: January 4, 2018Applicant: Ebara CorporationInventors: Hiroshi AONO, Kuniaki YAMAGUCHI, Hiroshi SHIMOMOTO, Koji MAEDA, Tetsuya YASHIMA, Kenji SHINKAI, Koichi HASHIMOTO, Mitsuhiko INABA, Hidetatsu ISOKAWA, Hidetaka NAKAO, Soichi ISOBE
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Publication number: 20170372893Abstract: The cleaning apparatus includes multiple kinds of cleaning modules each configured to perform a cleaning processing of a substrate, a first accommodating section configured to accommodate the multiple kinds of cleaning modules therein, and a fluid supply section configured to supply a fluid to the cleaning modules accommodated in the first accommodating section through a pipe. Each of the multiple kinds of cleaning modules includes a pipe connection portion having a common connection position to be connected with the pipe.Type: ApplicationFiled: June 23, 2017Publication date: December 28, 2017Inventors: Koji Maeda, Hiroshi Shimomoto, Kuniaki Yamaguchi, Hiroshi Aono, Tetsuya Yashima, Hidetatsu Isokawa, Kenji Shinkai, Mitsuhiko Inaba, Koichi Hashimoto, Junji Kunisawa, Mitsuru Miyazaki, Fujihiko Toyomasu
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Patent number: 7942725Abstract: A polishing apparatus has a top ring configured to hold a semiconductor wafer on a substrate holding surface, and a pushser configured to deliver the semiconductor wafer to the top ring and receive the semiconductor wafer from the top ring. The pushser includes a push stage having a substrate placement surface on which the semiconductor wafer is placed and an air cylinder configured to vertically move the push stage. The pushser also includes a high-pressure fluid port configured to eject a high-pressure fluid toward the semiconductor wafer.Type: GrantFiled: September 29, 2008Date of Patent: May 17, 2011Assignee: Ebara CorporationInventors: Hiroomi Torii, Takuji Hayama, Tetsuya Yashima
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Publication number: 20090068935Abstract: A polishing apparatus has a top ring configured to hold a semiconductor wafer on a substrate holding surface, and a pushser configured to deliver the semiconductor wafer to the top ring and receive the semiconductor wafer from the top ring. The pushser includes a push stage having a substrate placement surface on which the semiconductor wafer is placed and an air cylinder configured to vertically move the push stage. The pushser also includes a high-pressure fluid port configured to eject a high-pressure fluid toward the semiconductor wafer.Type: ApplicationFiled: September 29, 2008Publication date: March 12, 2009Inventors: Hiroomi TORII, Takuji Hayama, Tetsuya Yashima
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Patent number: 7445543Abstract: A polishing apparatus has a top ring configured to hold a semiconductor wafer on a substrate holding surface, and a pushser configured to deliver the semiconductor wafer to the top ring and receive the semiconductor wafer from the top ring. The pushser includes a push stage having a substrate placement surface on which the semiconductor wafer is placed and an air cylinder configured to vertically move the push stage. The pushser also includes a high-pressure fluid port configured to eject a high-pressure fluid toward the semiconductor wafer.Type: GrantFiled: October 14, 2004Date of Patent: November 4, 2008Assignee: Ebara CorporationInventors: Hiroomi Torii, Takuji Hayama, Tetsuya Yashima
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Publication number: 20060292967Abstract: A polishing apparatus has a top ring (1) configured to hold a semiconductor wafer (W) on a substrate holding surface and a pushser (130) configured to deliver the semiconductor wafer (W) to the top ring (1) and receive the semiconductor wafer (W) from the top ring (1). The pushser (130) includes a push stage (133) having a substrate placement surface on which the semiconductor wafer (W) is placed and an air cylinder (135) configured to vertically move the push stage (133). The pushser (130) also includes a high-pressure fluid port (220) configured to eject a high-pressure fluid toward the semiconductor wafer (W).Type: ApplicationFiled: October 14, 2004Publication date: December 28, 2006Inventors: Hiroomi Torii, Takuji Hayama, Tetsuya Yashima