Patents by Inventor Tetsuyasu Takahashi

Tetsuyasu Takahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110272768
    Abstract: Provided is a lead frame, an electronic device provided with a lead frame, a method of producing a lead frame, and a method of producing an electronic device provided with a lead frame that has been produced by the method of producing a lead frame, in which a lead frame is not corroded, a mechanical strength of the lead frame is not lowered, it is not necessary to carry out the conventional plating processing steps composed of two stages, the processes are simple, a cost is lower, and a large amount of waste liquid such as plating processing liquid is not generated, thereby preventing an environment from being affected. The lead frame includes an outer lead part and an inner lead part, and plating is carried out on at least a part of one or both of the outer lead part or the inner lead part.
    Type: Application
    Filed: September 12, 2008
    Publication date: November 10, 2011
    Applicants: SUN-A CORPORATION, MITSUI MINING & SMELTING CO., LTD.
    Inventors: Toshimi Nakamura, Toshiaki Kawanishi, Toshihiro Hosoi, Kenjiro Izutani, Hiroyuki Nakamura, Yutaka Osawa, Hiroaki Sunada, Tetsuyasu Takahashi