Patents by Inventor Tetsuyosyi Ogura

Tetsuyosyi Ogura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR CHIP, SEMICONDUCTOR MOUNTING MODULE, MOBILE COMMUNICATION DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR CHIP
    Publication number: 20110180900
    Abstract: A semiconductor chip comprising a capacitor capable of effectively controlling the voltage drop of an LSI is provided. A semiconductor substrate is provided with an element electrode having at least its surface constituted of an aluminum electrode. The surface of the aluminum electrode is roughened. An oxide film is provided on the aluminum electrode. A conductive film is provided on the oxide film. The aluminum electrode, oxide film and conductive film form a capacitor.
    Type: Application
    Filed: April 5, 2011
    Publication date: July 28, 2011
    Applicant: PANASONIC CORPORATION
    Inventors: Koichi HIRANO, Tetsuyosyi Ogura, Seiichi Nakatani