Abstract: A multilayer wiring board includes two or more layers laminated together, each layer includes an insulating resin layer having a first surface and a second surface, and a conductor layer. The insulating resin layer includes a first recess that is open to the first surface, a groove section that is open to the first surface, and a second recess that is open to the second surface and communicates with one or more of the first recesses. Each insulating resin layer is integrally formed in a thickness direction thereof. The conductor layer includes a land portion and a wiring portion filling the first recess and the groove section, and a via portion protruding from the first surface at a position of the land portion. The via portion protruding from the first surface of the insulating resin layer fills a recess of another insulating resin layer adjacent to the first surface.

Abstract: A glass core, a multilayer circuit board, and a method of manufacturing a glass core that appropriately form copper wiring, and suppresses crack and the like, a glass core includes: a glass plate; a first metal layer provided on the glass plate; a first electrolytic copper plating layer provided on the first metal layer; a dielectric layer provided above the first electrolytic copper plating layer; a second metal layer provided on the dielectric layer; an electroless nickel plating layer provided on the second metal layer and having a phosphorus content of less than 5 mass %; and a second electrolytic copper plating layer provided on the electroless nickel plating layer.

Abstract: A wiring board capable of suppressing migration between wires and to provide a method of producing the same, in a method of producing a wiring board provided with a first wiring board in which a first wiring layer is formed, and a second wiring board in which a second wiring layer finer than the first wiring layer is formed, the second wiring board is formed by performing steps of forming a first insulating resin layer provided with a wiring pattern and openings, forming a first inorganic insulating film on the first insulating resin layer, forming a first conductor layer corresponding to the wiring pattern and the openings on the inorganic insulating film, and forming a second inorganic insulating film on the first conductor layer.

Abstract: A glass wiring board that can be kept from cracking by better preventing concentration of stresses in a glass plate on which a conductor layer including an electrolytic copper plating layer is provided, the wiring board includes: a glass plate; a first metal layer covering at least a part of the glass plate; and a second metal layer covering at least a part of the first metal layer, and the area of the first metal layer in contact with the second metal layer is smaller than the area of the second metal layer facing the first metal layer.

Abstract: A glass wiring board that can be kept from cracking by better preventing concentration of stresses in a glass plate on which a conductor layer including an electrolytic copper plating layer is provided, the wiring board includes: a glass plate; a first metal layer covering at least a part of the glass plate; and a second metal layer covering at least a part of the first metal layer, and the area of the first metal layer in contact with the second metal layer is smaller than the area of the second metal layer facing the first metal layer.

Abstract: A technique for making a glass core substrate that is less prone to cracking. A core substrate of the present invention includes a glass plate and a first conductor pattern provided on a first main surface of the glass plate. The first conductor pattern includes a first nickel plating layer that is provided on the first main surface of the glass plate and has a phosphorus content of 5 mass % or less and a first copper plating layer that is provided on the first nickel plating layer.

Abstract: A technique for making a glass core substrate that is less prone to cracking. A core substrate of the present invention includes a glass plate and a first conductor pattern provided on a first main surface of the glass plate. The first conductor pattern includes a first nickel plating layer that is provided on the first main surface of the glass plate and has a phosphorus content of 5 mass % or less and a first copper plating layer that is provided on the first nickel plating layer.

Abstract: A glass core, a multilayer circuit board, and a method of manufacturing a glass core that appropriately form copper wiring, and suppresses crack and the like, a glass core includes: a glass plate; a first metal layer provided on the glass plate; a first electrolytic copper plating layer provided on the first metal layer; a dielectric layer provided above the first electrolytic copper plating layer; a second metal layer provided on the dielectric layer; an electroless nickel plating layer provided on the second metal layer and having a phosphorus content of less than 5 mass %; and a second electrolytic copper plating layer provided on the electroless nickel plating layer.

Abstract: A technique for making a glass core substrate that is less prone to cracking. A core substrate of the present invention includes a glass plate and a first conductor pattern provided on a first main surface of the glass plate. The first conductor pattern includes a first nickel plating layer that is provided on the first main surface of the glass plate and has a phosphorus content of 5 mass % or less and a first copper plating layer that is provided on the first nickel plating layer.

Abstract: A wiring substrate that helps prevent cracking of a base material at the time of formation of a light transmissive portion, has high light transmittance, and allows formation of fine wiring, and a method for manufacturing the same. The wiring substrate includes: a base material with light transmittance; a laminated body formed by laminating a metal layer and a resin layer on at least one side of the base material; and a light transmissive portion as an opening provided in part of the laminated body. The wiring substrate is characterized in that at least part of side surfaces defining the light transmissive portion is formed from the resin layer, and adjacent the surface of the base material, part of the metal layer is adjacent to the resin layer constituting at least part of the side surfaces defining the light transmissive portion and is disposed to surround the resin layer.

Abstract: There is provided a wiring substrate including an electrode including Cu or a Cu alloy, a plating film having a film including at least Pd, formed on the electrode, and a solder which is bonded onto the plating film by heating, has a melting point of lower than 140° C., and includes Pd dissolved therein, a Pd concentrated layer being absent between the solder and the electrode.

Abstract: A wiring substrate includes an electrode including Cu or a Cu alloy, and a plated film including an electroless nickel-plated layer formed on the electrode and an electroless gold-plated layer formed on the electroless nickel-plated layer. The electroless nickel-plated layer is formed by co-precipitation of Ni, P, Bi, and S, the electroless nickel-plated layer includes a content of P of 5% by mass or more and less than 10% by mass, a content of Bi of 1 ppm by mass to 1,000 ppm by mass, and a content of S of 1 ppm by mass to 2,000 ppm by mass, and a mass ratio of the content of S to the content of Bi (S/Bi) is more than 1.0.

Abstract: There is provided a wiring substrate including an electrode including Cu or a Cu alloy, a plating film having a film including at least Pd, formed on the electrode, and a solder which is bonded onto the plating film by heating, has a melting point of lower than 140° C., and includes Pd dissolved therein, a Pd concentrated layer being absent between the solder and the electrode.

Abstract: A wiring substrate includes an electrode including Cu or a Cu alloy, and a plated film including an electroless nickel-plated layer formed on the electrode and an electroless gold-plated layer formed on the electroless nickel-plated layer. The electroless nickel-plated layer is formed by co-precipitation of Ni, P, Bi, and S, the electroless nickel-plated layer includes a content of P of 5% by mass or more and less than 10% by mass, a content of Bi of 1 ppm by mass to 1,000 ppm by mass, and a content of S of 1 ppm by mass to 2,000 ppm by mass, and a mass ratio of the content of S to the content of Bi (S/Bi) is more than 1.0.