Patents by Inventor Tetsuzo Yoshimura
Tetsuzo Yoshimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20110177259Abstract: A method for readily manufacturing an optical waveguide having a high ?n value at low cost, and in specific, a self-organizing optical waveguide that optical waveguides having a high ?n value can be connected to each other; and a method for manufacturing the self-organizing optical waveguide. A method for manufacturing an optical waveguide, including step (A): forming a coating film on a lower clad portion using a coating solution including an oxide precursor containing a titanium atom and a silicon atom; and step (B): irradiating the coating film with a radiation beam under heating to form a core/clad layer including an irradiated core region having a higher refractive index and an unirradiated clad region having a refractive index lower than that of the core region.Type: ApplicationFiled: August 27, 2009Publication date: July 21, 2011Applicant: NISSAN CHEMICAL INDUSTRIES, LTD.Inventors: Tetsuo Sato, Tetsuzo Yoshimura
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Patent number: 7387913Abstract: A 3D micro optical switching system (3D-MOSS) is fabricated by dividing an optical switching system into several blocks, creating optoelectronic layers where optical switches or tunable filters in each block are disposed, laminating the optoelectronic layers by connecting the layers with optical connections. The fabrication process includes a first step of selectively exposing an adhesive bond whose adhesive strength changes by exposure, a second step of contacting the selectively-exposed adhesive bond with a thin-film device array on a first substrate, and a third step of selectively ring part of thin-film devices in the thin-film device array from the first substrate onto the selectively-exposed adhesive bond in accordance with an exposure pattern.Type: GrantFiled: July 25, 2002Date of Patent: June 17, 2008Assignees: JSR Corporation, Tetsuzo YoshimuraInventors: Tetsuzo Yoshimura, Yukihiko Arai
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Publication number: 20060261432Abstract: A 3D micro optical switching system (3D-MOSS) is fabricated by dividing an optical switching system into several blocks, creating optoelectronic layers where optical switches or tunable filters in each block are disposed, laminating the optoelectronic layers by connecting the layers with optical connections. The fabrication process includes a first step of selectively exposing an adhesive bond whose adhesive strength changes by exposure, a second step of contacting the selectively-exposed adhesive bond with a thin-film device array on a first substrate, and a third step of selectively ring part of thin-film devices in the thin-film device array from the first substrate onto the selectively-exposed adhesive bond in accordance with an exposure pattern.Type: ApplicationFiled: July 28, 2006Publication date: November 23, 2006Applicants: JSR Corporation, Tetsuzo YOSHIMURAInventors: Tetsuzo Yoshimura, Yukihiko Arai
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Patent number: 6912333Abstract: For example, a surface emitting semiconductor laser and a driver IC are arranged three-dimensionally to put a submounting substrate between them, and LSIs such as a CPU, etc. are mounted on the driver IC. The surface emitting semiconductor laser is formed of the epitaxial lift-off (ELO) process and has a thickness of about 10 ?m. A through hole is provided to all the submounting substrate, the surface emitting semiconductor laser, the driver IC, and the LSIs. These parts are connected electrically mutually via conductor in the through hole.Type: GrantFiled: June 20, 2003Date of Patent: June 28, 2005Assignee: Fujitsu LimitedInventors: Takashi Mikawa, Tetsuzo Yoshimura, Osamu Ibaragi
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Patent number: 6845184Abstract: Opto-electrical systems having electrical and optical interconnections formed in thin layers are disclosed. In one set of preferred embodiments, optical signals are conveyed between layers by respective vertical optical couplers disposed on the layers. In other preferred embodiments, optical signals are conveyed by stack optical waveguide coupling means. Yet other preferred embodiments have electrical via means formed in one or more layers to covey electrical signals between two or more layers.Type: GrantFiled: April 20, 1999Date of Patent: January 18, 2005Assignee: Fujitsu LimitedInventors: Tetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, Michael G. Lee, William Chou, Solomon I. Beilin, Wen-chou Vincent Wang, James J. Roman, Thomas J. Massingill
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Patent number: 6785447Abstract: An optoreflective structure for reflecting an optical signal following a path defined by an optical waveguide comprising a first cladding layer having a first planar cladding surface; a waveguide disposed on the first cladding layer; and a second cladding layer disposed on the waveguide and having a second planar cladding surface. The first cladding layer, the second cladding layer and the waveguide terminate in a generally dove-tailed structure having a beveled planar surface. An optoreflector is disposed on the beveled planar surface for a changing direction of an optical signal passing through the waveguide. Methods of producing the optoreflective structure are disclosed.Type: GrantFiled: January 22, 2001Date of Patent: August 31, 2004Assignee: Fujitsu LimitedInventors: Tetsuzo Yoshimura, Yasuhito Takahashi, James Roman, Solomon I. Beilin, Wen-chou Vincent Wang, Masaaki Inao
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Patent number: 6706546Abstract: A method of constructing an electronic circuit assembly comprising forming at least one electrode on a substrate; forming a layer of undercladding material upon the substrate and over the electrode; and forming a wave guide core layer on the layer of cladding material. The wave guide layer is patterned to produce at least one optical wave guide and exposed undercladding material. The method of constructing further includes forming a layer of overcladding material upon the exposed undercladding material and over the optical wave guide; forming at least one via aperture through the overcladding material and the undercladding material; and disposing a conductive material in the via aperture to produce an electronic circuit assembly.Type: GrantFiled: January 8, 2001Date of Patent: March 16, 2004Assignee: Fujitsu LimitedInventors: Tetsuzo Yoshimura, Yashuhito Takahashi, Kiyoshi Kuwabara, Solomon I. Beilin, Michael Peters, Wen-Chou Vincent Wang, Masaaki Inao
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Publication number: 20040033008Abstract: For example, a surface emitting semiconductor laser and a driver IC are arranged three-dimensionally to put a submounting substrate between them, and LSIs such as a CPU, etc. are mounted on the driver IC. The surface emitting semiconductor laser is formed of the epitaxial lift-off (ELO) process and has a thickness of about 10 &mgr;m. A through hole is provided to all the submounting substrate, the surface emitting semiconductor laser, the driver IC, and the LSIs. These parts are connected electrically mutually via conductor in the through hole.Type: ApplicationFiled: June 20, 2003Publication date: February 19, 2004Applicant: Fujitsu LimitedInventors: Takashi Mikawa, Tetsuzo Yoshimura, Osamu Ibaragi
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Patent number: 6693736Abstract: An optical circuit system which takes out at least a portion of the light of a light power source corresponding to at least one type of output voltage of an IC, board, multichip module, electronic element, or opto-electronic element and produces an optical signal, wherein the light power source is an optical waveguide into which light has been introduced, a waveguide laser, or a waveguide optical amplifier, light reflecting portions are provided at its ends and/or middle, a signal transmission waveguide is formed in contact with the side surface and/or top or bottom surface of the optical waveguide or in proximity to the same at a certain distance, and the optical signal corresponding to at least one type of output voltage of the IC, board, multichip module, electronic element, or opto-electronic element is made to propagate to the signal transmission waveguide, which optical circuit system is rich in flexibility and enables complicated optical interconnections to be handled, and components of the same.Type: GrantFiled: October 17, 2000Date of Patent: February 17, 2004Assignee: Fujitsu LimitedInventors: Tetsuzo Yoshimura, Takeshi Ishitsuka, Katsusada Motoyoshi, Satoshi Tatsuura, Wataru Sotoyama, Koji Tsukamoto, Yasuhiro Yoneda, Tomoaki Hayano, Azuma Matsuura
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Patent number: 6690845Abstract: Three-dimensional opto-electronic modules having a plurality of opto-electronic (O/E) layers, with optical signals being routed between O/E layers within one or more three-dimensional volumes, are disclosed. In preferred embodiments, the O/E layers are disposed over and above one another with at least one of their edges aligned to one another. At least two of the O/E layers have waveguides with ends near the aligned edges. A plurality of Zconnector arrays are disposed between the O/E layers and within the three-dimensional volumes to provide a plurality of Zdirection waveguides. A first vertical optical coupler couples light from one waveguide in one O/E layer to a Z-direction waveguide, and a second vertical optical coupler couples the light from the Z-direction waveguide to a second waveguide in a second O/E layer. In further preferred embodiments, segments of the Z-connector arrays are held by a holding unit.Type: GrantFiled: May 19, 2000Date of Patent: February 10, 2004Assignee: Fujitsu LimitedInventors: Tetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, Michael G. Lee, William Chou, Solomon I. Beilin, Wen-chou Vincent Wang, James J. Roman, Thomas J. Massingill
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Patent number: 6684007Abstract: An optical apparatus including an optical substrate having an embedded waveguide and an optical device adapted to receive light transmitted from an end of the waveguide. The optical apparatus includes a coupling structure for coupling the optical device to the substrate. The coupling structure has a thin metallic layer with an aperture. At least a portion of the optical device is disposed in the aperture. A method for making an optical apparatus comprising forming an optical substrate having a waveguide embedded therein; depositing a metal layer over an end of the waveguide; and depositing a polymeric layer over the metal layer. An aperture is formed in the metal layer and in the polymeric layer by removing a portion of the metal layer and a portion of the polymeric layer disposed over the end of the waveguide.Type: GrantFiled: May 9, 2001Date of Patent: January 27, 2004Assignee: Fujitsu LimitedInventors: Tetsuzo Yoshimura, Yasuhito Takahashi, James Roman, Mark Thomas McCormack, Solomon I. Beilin, Wen-chou Vincent Wang, Masaaki Inao
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Patent number: 6669801Abstract: A method for transferring devices to a device substrate is disclosed. In one embodiment, the method includes providing an array of devices on a carrier substrate having a generally horizontal surface, where the array comprises multiple device pluralities. The method includes tilting the device pluralities with respect to the generally horizontal surface of the carrier substrate. Each tilted device plurality is preferably in substantially the same pattern, and each tilted device plurality is placed on device regions on respective device substrates.Type: GrantFiled: May 9, 2001Date of Patent: December 30, 2003Assignee: Fujitsu LimitedInventors: Tetsuzo Yoshimura, James Roman, Wen-chou Vincent Wang, Masaaki Inao, Mark Thomas McCormack
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Patent number: 6611635Abstract: Disclosed is device and/or material integration into thin opto-electronic layers, which increase room for chip-mounting, and reduce the total system cost by eliminating the difficulty of optical alignment between opto-electronic devices and optical waveguides. Opto-electronic devices are integrated with optical waveguides in ultra thin polymer layers on the order of 1 &mgr;m to 250 &mgr;m in thickness.Type: GrantFiled: April 20, 1999Date of Patent: August 26, 2003Assignee: Fujitsu LimitedInventors: Tetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, Michael G. Lee, William Chou, Solomon I. Beilin, Wen-chou Vincent Wang, James J. Roman, Thomas J. Massingill
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Publication number: 20020097962Abstract: An optoreflective structure for reflecting an optical signal following a path defined by an optical waveguide comprising a first cladding layer having a first planar cladding surface; a waveguide disposed on the first cladding layer; and a second cladding layer disposed on the waveduide and having a second planar cladding surface. The first cladding layer, the second cladding layer and the waveguide terminate in a generally dove-tailed structure having a beveled planar surface. An optoreflector is disposed on the beveled planar surface for a changing direction of an optical signal passing through the waveguide. A method for producing an optoreflective structure comprising providing a substrate supporting a first cladding layer having a first planar cladding surface; disposing a waveguide material on the first cladding layer; and forming on the waveguide material a second cladding layer having a second planar cladding surface.Type: ApplicationFiled: January 22, 2001Publication date: July 25, 2002Inventors: Tetsuzo Yoshimura, Yasuhito Takahashi, James Roman, Solomon I. Beilin, Wen-chou Vincent Wang, Masaaki Inao
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Publication number: 20020039464Abstract: A method of constructing an electronic circuit assembly comprising forming at least one electrode on a substrate; forming a layer of undercladding material upon the substrate and over the electrode; and forming a wave guide core layer on the layer of cladding material. The wave guide layer is patterned to produce at least one optical wave guide and exposed undercladding material. The method of constructing further includes forming a layer of overcladding material upon the exposed undercladding material and over the optical wave guide; forming at least one via aperture through the overcladding material and the undercladding material; and disposing a conductive material in the via aperture to produce an electronic circuit assembly.Type: ApplicationFiled: January 8, 2001Publication date: April 4, 2002Inventors: Tetsuzo Yoshimura, Yasuhito Takahashi, Kiyoshi Kuwabara, Solomon I. Beilin, Michael Peters, Wen-chou Vincent Wang, Masaaki Inao
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Publication number: 20020036055Abstract: A method for transferring devices to a device substrate is disclosed. In one embodiment, the method includes providing an array of devices on a carrier substrate having a generally horizontal surface, where the array comprises multiple device pluralities. The method includes tilting the device pluralities with respect to the generally horizontal surface of the carrier substrate. Each tilted device plurality is preferably in substantially the same pattern, and each tilted device plurality is placed on device regions on respective device substrates.Type: ApplicationFiled: May 9, 2001Publication date: March 28, 2002Inventors: Tetsuzo Yoshimura, James Roman, Wen-chou Vincent Wang, Masaaki Inao, Mark Thomas McCormack
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Publication number: 20020028045Abstract: An optical apparatus including an optical substrate having an embedded waveguide and an optical device adapted to receive light transmitted from an end of the waveguide. The optical apparatus includes a coupling structure for coupling the optical device to the substrate. The coupling structure has a thin metallic layer with an aperture. At least a portion of the optical device is disposed in the aperture. A method for making an optical apparatus comprising forming an optical substrate having a waveguide embedded therein; depositing a metal layer over an end of the waveguide; and depositing a polymeric layer over the metal layer. An aperture is formed in the metal layer and in the polymeric layer by removing a portion of the metal layer and a portion of the polymeric layer disposed over the end of the waveguide.Type: ApplicationFiled: May 9, 2001Publication date: March 7, 2002Inventors: Tetsuzo Yoshimura, Yasuhito Takahashi, James Roman, Mark Thomas McCormack, Solomon I. Beilin, Wen-chou Vincent Wang, Masaaki Inao
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Patent number: 6343171Abstract: Opto-electrical systems having electrical and optical interconnections formed in thin layers with thin-film active devices are disclosed. In one embodiment, optical connections are made between the edge of one substrate and the surface of another substrate with the use of photorefractive materials. In another embodiment, the optical connection is made by separating a optical film from the first substrate and coupling the first substrate and the optical film to separate receptacles located on the second substrate. Film optical link modules employing aspects of the invention are also disclosed.Type: GrantFiled: April 20, 1999Date of Patent: January 29, 2002Assignee: Fujitsu LimitedInventors: Tetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, Michael G. Lee, William Chou, Solomon I. Beilin, Wen-chou Vincent Wang, James J. Roman, Thomas J. Massingill
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Patent number: 6338975Abstract: An optical circuit device is manufactured by forming an organic film formed on a substrate, and giving this organic film non-linear optical properties. An optical circuit device is formed containing an organic film formed on a substrate, wherein said film is either selectively formed on a portion of the region on a substrate or said film being formed over the entire region on a substrate, and a portion of a region of that film is either selectively formed to a thickness differing from other regions or selectively having a different structure. This optical circuit device can be manufactured to have various constitutions, and allows the formation of a multilayer optical circuit.Type: GrantFiled: February 25, 1999Date of Patent: January 15, 2002Assignee: Fujitsu LimitedInventors: Tetsuzo Yoshimura, Satoshi Tatsuura, Wataru Sotoyama, Yasuhiro Yoneda, Katsusada Motoyoshi, Koji Tsukamoto, Takeshi Ishitsuka
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Patent number: 6294794Abstract: A non-linear optical device includes a plurality of quantum dots in an active layer such that the quantum dots have a composition or doping modified asymmetric in a direction perpendicular to the active layer.Type: GrantFiled: February 4, 1998Date of Patent: September 25, 2001Assignee: Fujitsu LimitedInventors: Tetsuzo Yoshimura, Toshiro Futatsugi