Patents by Inventor Tetuhiro Nakano

Tetuhiro Nakano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mounting structure of electronic component on substrate board
    Patent number: 6303878
    Abstract: A BGA package is mounted on a multi-layer printed wiring board having a plurality of electrodes arranged in a matrix form through a plurality of solder bumps. In the most externally-located electrodes, a lead wire is formed to extend from a portion of the most-externally-located electrode located inside of a polygon formed by connecting each of the centers of adjacent most-externally-located electrodes. Therefore, the solder bumps are prevented from coming off the most-externally-located electrodes because a portion of the most-externally-located electrode to which stress caused by an external shock is intensively applied is located in an outside of the polygon. Thus, a contact failure between the BGA package and the multi-layer printed wiring board is prevented.
    Type: Grant
    Filed: July 23, 1998
    Date of Patent: October 16, 2001
    Assignee: Denso Corporation
    Inventors: Kenji Kondo, Masayuki Aoyama, Koji Kondo, Masanori Takemoto, Hidehiro Mikura, Tetuhiro Nakano