Patents by Inventor Tetuhiro Semura

Tetuhiro Semura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5234788
    Abstract: A developer composition for electrophotography comprising a binding resin and a colorant, said binding resin comprising a first linear polyester having a softening point, Tsp, in the range of from 105.degree. C. to 170.degree. C. exclusive, and a second linear polyester having a softening point, Tsp, in the range of from 80.degree. C. to 105.degree. C. exclusive and lower than that of the first linear polyester by at least 10.degree. C., the weight ratio of the first linear polyester to the second linear polyester being (80:20) to (20:80) is disclosed.The developer composition of the present invention is excellent in the hot offset resistance, low temperature fixation, smoothness of fixed face, blocking resistance and transparency.
    Type: Grant
    Filed: December 30, 1991
    Date of Patent: August 10, 1993
    Assignee: KAO Corporation
    Inventors: Eizi Morimoto, Kuniyasu Kawabe, Tetuhiro Semura
  • Patent number: 5234787
    Abstract: A developer composition for electrophotography comprising a binding resin and a colorant, said binding resin comprising a specified nonlinear first polyester and a specified linear second polyester, the weight ratio of the first polyester to the second polyester being (80:20) to (20:80), is disclosed.The developer composition of the present invention is excellent in hot offset resistance, low temperature fixation, smoothness and transparency of fixed face, and blocking resistance.
    Type: Grant
    Filed: December 30, 1991
    Date of Patent: August 10, 1993
    Assignee: Kao Corporation
    Inventors: Eizi Morimoto, Kuniyasu Kawabe, Tetuhiro Semura