Patents by Inventor Tetuo Hori

Tetuo Hori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of joining flat-plate electrodes
    Patent number: 5129933
    Abstract: A method and apparatus for joining flat-plate electrodes wherein a spacer, to which a joining material such as a low-melting-point crystallized glass containing a crystallization promoting agent is applied, is interposed between the electrodes to be joined. The electrodes and spacer are placed and held between upper and lower attraction dies. The upper and lower attraction dies are placed between upper and lower heating blocks for heating and pressing the electrodes and spacer through the attraction dies to join the electrodes via molten joining material.
    Type: Grant
    Filed: May 11, 1990
    Date of Patent: July 14, 1992
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Isao Muragishi, Takashi Suzuki, Takashi Kanehisa, Tetuo Hori, Asao Iguchi