Abstract: A glass sealing type ceramic package comprises: a ceramic substrate having a cavity for disposing a semiconductor device therein and a glass layer on a first main surface of the ceramic substrate, a ceramic cap having a glass layer on a second main surface thereof, a plurality of lead frames supported by opposing the first and second main surfaces to each other, and the semiconductor device being hermetically sealed in the cavity by fusing the first and second glass layers. According to a feature of this invention, the first main surface of the ceramic substrate is formed by a metallized layer; the glass layer is formed on the metallized layer, leaving a narrower outer periphery of the substrate; 70 to 90% of said lead frames are connected directly to a pad of the semiconductor device by way of metal wires; and a remainder thereof is connected indirectly to the pad of the semiconductor device by way of the metallized layer.