Patents by Inventor Tetuso Nakai

Tetuso Nakai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding tool
    Patent number: 5197651
    Abstract: A bonding tool for TAB, used in the production of semiconductor chips, which is provided with, at the end thereof, a substrate consisting of a member selected from the group consisting of sintered compacts of Si or Si.sub.3 N.sub.4 as a predominant component, sintered compacts of SiC as a predominant component, sintered compacts of AlN as a predominant component and composite compacts thereof, the substrate being coated with polycrystalline diamond deposited by gaseous phase synthesis method.
    Type: Grant
    Filed: August 24, 1990
    Date of Patent: March 30, 1993
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Tsutomu Nakamura, Katsuyuki Tanaka, Tetuso Nakai, Takahiro Imai, Akihiko Ikegaya, Naoji Fujimori