Abstract: Disclosed is a curable epoxy resin composition which is effectively cured at ambient temperature and when cured has excellent adhesive strength and good water resistance. The epoxy resin composition comprises:(a) an epoxy resin having at least two epoxy groups in one molecule,(b) a monofunctional (meth)acrylate represented by ##STR1## wherein R.sub.1 represents a hydrogen atom or an alkyl group having 1 to 12 carbon atoms, R.sub.2 and R.sub.3 respectively represent a hydrogen atom or a methyl group, and n is an integer of 1 to 4, and(c) An amine curing agent selected from the group consisting of an aromatic polyamine, a modified aromatic polyamine, a polyamideamine and a mixture thereof. The present invention also provides an adhesive composition prepared from the above mentioned curable epoxy resin composition.