Abstract: The invention relates to a method of electroplating metal, primarily chromium, onto a workpiece connected as a cathode in a current circuit, the workpiece being fed through an electrolyte bath past the anode of the current circuit. Prior to moving the workpiece past the anode, the workpiece is moved past a member in the electrolyte bath which is generally parallel to the direction of movement of the workpiece and which is generally closer to the workpiece than the anode. This member controls the current density between the member and the workpiece, causing the workpiece to be etched as it passes the member.

Abstract: An electroplating apparatus for applying a protecting metallic coating on the surface of a workpiece, the apparatus featuring a process chamber for containing an electrolytic solution, and means for leading an electric current to the workpiece and to the solution. A pneumatic pressure reducing pump is further provided for creating subatmospheric pressure about said process chamber and the spaces containing said electrolytic solution which is in communication with the electrolytic solution in the process chamber, whereby the use of a high electrical current density during electroplating is possible.