Abstract: Embodiments described herein may be related to apparatuses, processes, systems, and/or techniques for an enclosure, which may be referred to as a cartridge, that surrounds a semiconductor device prior to the semiconductor device being bombarded with an electron beam during operational testing. In embodiments, the enclosure may include a cooling plate that includes a thermal cooling mechanism that is thermally coupled with the semiconductor device to control the temperature of the semiconductor device during testing. The thermal cooling mechanism may include a manifold that extends through the plate through which a cooled fluid, cooled air, or some other cool material may be circulated to cool the semiconductor device. Other embodiments may be described and/or claimed.

Abstract: Embodiments disclosed herein include a thermal testing unit. In an embodiment, the thermal testing unit comprises a nozzle frame, and a nozzle plate within the frame. In an embodiment, the nozzle plate comprises a plurality of orifices through a thickness of the nozzle plate. In an embodiment, the thermal testing unit further comprises a housing attached to the nozzle plate.

Abstract: Embodiments disclosed herein include a thermal testing unit. In an embodiment, the thermal testing unit comprises a nozzle frame, and a nozzle plate within the frame. In an embodiment, the nozzle plate comprises a plurality of orifices through a thickness of the nozzle plate. In an embodiment, the thermal testing unit further comprises a housing attached to the nozzle plate.