Patents by Inventor Thad C. McMillan, Jr.

Thad C. McMillan, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHODS FOR REDUCING CORROSION ON PRINTED CIRCUIT BOARDS
    Publication number: 20090236129
    Abstract: A method for processing a printed circuit board (PCB) wherein the method includes providing a substrate in contact with a metal surface, contacting the metal surface with an immersion silver solution thereby producing an immersion silver layer upon the metal surface, and thereafter, providing a solder mask in contact with the metal surface and the immersion silver layer.
    Type: Application
    Filed: March 19, 2008
    Publication date: September 24, 2009
    Applicant: DELL PRODUCTS L.P.
    Inventors: Randolph D. Schueller, Thad C. McMillan, JR.
  • Multilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling same
    Patent number: 5262594
    Abstract: A rigid-flex printed circuit board having a rigid section and a flexible section extending from the rigid section is disclosed. The rigid-flex printed circuit board is capable of withstanding high temperatures experienced in high volume production environments utilizing infrared reflow ovens by providing spacers and covers for protecting the flexible section from high temperatures. A process for assembling components and devices on the rigid-flex printed circuit board in a high volume production environment utilizing infrared reflow ovens is also disclosed.
    Type: Grant
    Filed: October 12, 1990
    Date of Patent: November 16, 1993
    Assignees: Compaq Computer Corporation, Teledyne Industries, Inc.
    Inventors: Eric R. Edwin, James J. Tumlinson, Jerome A. Wilson, Thad C. McMillan, Jr., Rollin G. Meyer, Darryl J. McKenney
  • Multilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling same
    Patent number: 5178318
    Abstract: A rigid-flex printed circuit board having a rigid section and a flexible section extending from the rigid section is disclosed. The rigid-flex printed circuit board is capable of withstanding high temperatures experienced in high volume production environments utilizing infrared reflow ovens by providing spacers and covers for protecting the flexible section from high temperatures. A process for assembling components and devices on the rigid-flex printed circuit board in a high volume production environment utilizing infrared reflow ovens is also disclosed.
    Type: Grant
    Filed: June 6, 1991
    Date of Patent: January 12, 1993
    Assignee: Compaq Computer Corp.
    Inventors: Eric R. Edwin, James J. Tumlinson, Jerome A. Wilson, Thad C. McMillan, Jr., Rollin G. Meyer, Darryl J. McKenney