Patents by Inventor Thaddeus Tomkiewicz

Thaddeus Tomkiewicz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4886942
    Abstract: A strain relief structure is provided for direct cable to circuit board connections. The strain relief structure is securely mountable to the circuit board and comprises a body which includes at least one cable receiving aperture extending therethrough. The cable receiving aperture is characterized by a deflectable strain relief engagement for engaging the insulation on the cable and providing necessary strain relief. The aperture is constructed to alternatively permit first and second depths of insertion, each of which permits engagement of the strain relief structure with the cable. The first depth of insertion substantially encloses the exposed conductors of the cable to prevent damage during shipment and storage. The second depth of insertion enables electrical connection between the cable conductors and conductive areas on the circuit board.
    Type: Grant
    Filed: February 24, 1989
    Date of Patent: December 12, 1989
    Assignee: Molex Incorporated
    Inventors: William Lenz, Arvind Patel, Thaddeus Tomkiewicz