Abstract: An optical fiber retention device that has a generally planar body having a surface coated with an adhesive. The optical fiber is affixed to the surface by adhering to the adhesive coated surface such that the surface holds the fiber in position but the fiber can be easily removed by pulling the desired length of fiber off of the coated surface. A plurality of tabs extend outwardly from the planar body and contact the printed circuitboard for positioning the planar body at a predetermined distance away from the circuitboard to enable electronic components to be located on the circuitboard beneath the planar body. The tabs also have a planar surface coated with an adhesive that contacts the circuitboard to mount the optical fiber retention device to the circuitboard.

Abstract: A new physical design for electronic devices (100) comprises a multi-layer stacked assembly (104-110) of a plurality of pan-shaped conductive units that form the layers of the assembly. Each unit is preferably formed from a single sheet of metal into which electronic components, such as an antenna array (208) or a filter array (314) of a transceiver, have been stamped, cut, or etched, and which is then bent around its periphery to form a pan shape. The pans are oriented to face the same direction, are stacked one on top of another, and are fixedly attached to each other by weld, solder, or adhesive. The electrical components defined by the different units are electrically interconnected in a connectorless manner, preferably by flanges (122, 124) formed in the same sheets of metal as the units themselves and extending between the units. Adjacent units in the stack define electromagnetically isolated chambers, e.g., for the filter array. Some layers perform double duty, e.g.

Abstract: An optical fiber retention device that has a generally planar body having a surface coated with an adhesive. The optical fiber is affixed to the surface by adhering to the adhesive coated surface such that the surface holds the fiber in position but the fiber can be easily removed by pulling the desired length of fiber off of the coated surface. A plurality of tabs extend outwardly from the planar body and contact the printed circuitboard for positioning the planar body at a predetermined distance away from the circuitboard to enable electronic components to be located on the circuitboard beneath the planar body. The tabs also have a planar surface coated with an adhesive that contacts the circuitboard to mount the optical fiber retention device to the circuitboard.

Abstract: An electronic device package is made by first making in a stencil member (11) an opening (12) in the shape of a closed loop that surrounds an inner portion (13) of the stencil member. The closed loop is a continuous opening except for a plurality of web members (15), each of which extends across the opening to secure the inner stencil portion to the remainder of the stencil member. A glass slurry (7) is forced through the opening of the stencil member onto a first substrate (18) so as to form on the substrate a substantially closed loop of glass slurry, which is thereafter glazed to form a glass loop (32) bonded to the first substrate. The first substrate is used as cover plate and placed over a second substrate (24) containing an electronic device (23) such that the glass loop surrounds the electronic device and contacts the second substrate along its entire length. The glass is heated sufficiently to soften it and cause it to bond to the second substrate as well as the first substrate.

Abstract: An improved stencil (10), for screen printing a material (22) onto a substrate (20), comprises a sheet (12) provided with a plurality of trapezoidal openings (14) arranged in alternating fashion such that the taper of each opening is opposite to the taper of the opening adjacent thereto. Providing the stencil with alternating trapezoidal openings (14) improves the resolution of the pattern of material (22) printed on the substrate when the material is deposited on the stencil and a squeegee blade (24) is displaced thereacross to force the material into the openings (14). The quality of the pattern of the material (22) printed on the substrate (20) can be further improved by providing a friction-reducing coating (34) on the sheet (12) to reduce the drag of the squeegee blade (24) as it travels thereacross.

Abstract: A commutator shell suitable for receiving a molded commutator core is fabricated by providing an elongated ribbon of electrically conductive material. The ribbon is passed through a set of rollers to form a plurality of relatively shallow preliminary grooves of a given width longitudinally on one side of the ribbon to partially displace the conductive material. The ribbon is passed through a subsequent set of rollers to form the preliminary grooves to a full depth and to completely displace the material to a width substantially equal to that of the preliminary grooves to form the predetermined pattern of grooves between adjacent ribs. The ribbon is passed through a further set of rollers to form valleys in the tops of the ribs and to divide the ribs into dove-tailed cross-sections overhanging adjacent grooves.

Abstract: The present invention relates to a method for depositing a viscous material (11), such as solder paste, onto a substrate (16), such as a printed circuit board. The solder paste is expelled (12) out from a dispenser (20) into a void between a pair of flexible members (30) extending therefrom for contact with a foraminous member (12) such as a stencil, proximate the printed circuit board. A relative motion is imparted between the dispenser and the foraminous member so that at least one of the flexible members forces the solder paste through the openings in the stencil and onto the circuit board. In accordance with the invention, the dispenser is pivoted when the relative motion is imparted between the dispenser and the stencil to raise the leading one of the flexible members a predetermined distance from the stencil.

Abstract: An apparatus (28) for dispensing solder paste into openings (26-26) in a stencil (24) comprises a housing (30) having a piston (60) slidably mounted therein. A manifold (70), having a successively increasing cross-sectional area, is attached to a side wall (42) of the housing for admitting a viscous material, such as solder paste therein through successively larger sized openings (76-76) so the paste is distributed evenly beneath the piston. A pair of elastomeric blades (50-50) are secured to, and depend from the housing on opposite sides of a slot (46) to contact the stencil (24). Upon the application of a fluid pressure against the piston, paste will be expelled from the slot within a working region (96) between the blades. The blades force paste into the openings in the stencil when the housing is moved thereacross.

Abstract: A multipoint dispensing of viscous material onto a board (23) comprises the monitoring and controlling of several process parameters such as the initial gap (.delta.) between a dispensing tool (20,25) and the board (23), the dispense pressure time cycle within the tool (FIG. 3A) and the tool velocity cycle (FIG. 3B). Also, an improved method for loading solder paste into the dispensing tool includes applying vacuum to two regions of the tool while vibrating it in its axial direction (FIG. 4). Furthermore, improved techniques for preventing crust formation on the paste within the tool, and for controlling the viscosity of the solder paste within the tool, achieve consistent dispensing results in a production environment.

Abstract: A multipoint dispensing of viscous material onto a board (23) comprises the monitoring and controlling of several process parameters such as the initial gap (.delta.) between a dispensing tool (20,25) and the board (23), the dispense pressure time cycle within the tool (FIG. 3A) and the tool velocity cycle (FIG. 3B). Also, an improved method for loading solder paste into the dispensing tool includes applying vacuum to two regions of the tool while vibrating it in its axial direction (FIG. 4). Furthermore, improved techniques for preventing crust formation on the paste within the tool, and for controlling the viscosity of the solder paste within the tool, achieve consistent dispensing results in a production environment.

Abstract: A thick solder blob (56) is bonded to a land area 34 on a metallized substrate (31) by (a) depositing a thick layer of solder paste on the land area; (b) confining the solder paste with a hard material; and (c) reflowing the solder paste to bond the solder blob (56) to the land area (34) while maintaining the thickness thereof.

Abstract: Apparatus for decontaminating radioactive components comprising an attachment mechanism for completely suspending the apparatus from the tube sheet of a nuclear steam generator, a first drive mechanism for moving the apparatus in a first direction, a second drive mechanism for pivoting the apparatus in a second direction, and a third drive mechanism for moving the apparatus in a third independent direction. The apparatus also comprises a dual nozzle arrangement attached to the third drive mechanism for directing a water-grit mixture toward the component to be decontaminated. The apparatus provides a mechanism for remotely decontaminating the channel head of a nuclear steam generator so as to allow working personnel to enter therein.

Abstract: A probe positioner capable of being supported from a tube sheet of a nuclear steam generator for positioning a probe in relationship to the tube sheet of the nuclear steam generator comprises a locking mechanism for locking the probe positioner in the tube sheet and a plurality of rotatable arms for positioning the probe. The probe positioner also comprises quick disconnect motors for rotating the arms of the probe positioner relative to each other.

Abstract: Two abutting members are locked together by reaming a hole entirely through one member and at least partly through the other, machining a circular groove in each through hole just below the surface of the member, press fitting a dowel pin having a thin wall extension on at least one end thereof into the hole in both members, a thin wall extension extending into each through hole, crimping or snapping the thin wall extension into the grooves to positively lock the dowel pin in place and, if necessary, tack welding the end of the thin-wall extension in place.