Patents by Inventor Tham Heang Chew

Tham Heang Chew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor Package
    Publication number: 20090310322
    Abstract: A substrate includes a number of protruding contact elements. An electrical circuit with electrical contact elements is provided on the substrate. A layer of substrate adhesive is provided on the substrate, the substrate adhesive being in contact with the substrate, with the electrical circuit and with the protruding contact elements. Wiring elements are connected between the protruding contact elements and the electrical contact elements.
    Type: Application
    Filed: July 1, 2009
    Publication date: December 17, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Liang Kng Ian Koh, Wai Lian Jenny Ong, Tham Heang Chew, Hai Guan Loh