Patents by Inventor Thang Toan Nguyen

Thang Toan Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6069791
    Abstract: A cooling device for a notebook personal computer which has a personal computer body accommodating an exothermic electronic element and a display hinged in an openable/closable manner to the personal computer body through a hinge mechanism, including a first heat pipe having a first end portion arranged along the display and a second end portion arranged in parallel with a center line of rotation of said hinge mechanism; a second heat pipe having a first end portion arranged on the electronic element in a heat transferable manner and a second end portion arranged in thermal contact with the second end portion of said first heat pipe; and a connector defining a first hole having an axis and configured to receive the second portion of the first heat pipe, a second hole having an axis different from the axis of the first hole and configured to receive the second portion of the second heat pipe, the first and second holes communicating with each other; wherein at least one of the second end portions is positioned
    Type: Grant
    Filed: August 14, 1997
    Date of Patent: May 30, 2000
    Assignee: Fujikura Ltd.
    Inventors: Kazuhiko Goto, Koichi Mashiko, Yuji Saito, Thang Toan Nguyen, Masataka Mochizuki, Katsuo Eguchi, Hitoshi Hasegawa
  • Patent number: 5964279
    Abstract: An electronic device cooler for cooling an exothermic member arranged in a case, including an air compressor configured to compress adiabatically air in the case to an elevated temperature. Also included is a heat pipe configured to discharge heat from the air adiabatically compressed to the elevated temperature to an outside of said case, and an expansion turbine configured to expand adiabatically the air having heat discharged by the heat pipe to a reduced temperature.
    Type: Grant
    Filed: February 9, 1998
    Date of Patent: October 12, 1999
    Assignee: Fujikura Ltd.
    Inventors: Masataka Mochizuki, Koichi Mashiko, Kazuhiko Goto, Yuji Saito, Katsuo Eguchi, Yoshihiro Nagaki, Akihiro Takamiya, Thang Toan Nguyen