Abstract: Techniques for improving the manufacture and structure of leadframe chip scale packages and land grid array packages are described. One aspect of the invention pertains to a method for patterning a conductive substrate, which is utilized to form a packaged semiconductor device, wherein a metallic barrier layer and a second metallic layer are utilized as an etching resist. A method, according to another aspect of the invention pertains to covering a metallic barrier layer and second metallic layer with a etch resistant cap such that the etch resistant cap is used as a etching resist. In another aspect of the present invention, a method for treating a conductive leadframe with a CZ treatment is disclosed. In yet another aspect of the present invention, techniques relating to locking grooves within the studs of a studded leadframe are disclosed.

Abstract: A variety of improved substrate structures and substrate fabrication techniques for use in integrated circuit packaging are described. In one aspect, a substrate strip fabrication technique that facilitates strip testing of the dice mounted thereon is described. The described technique works well even when landings on the substrate are electrolytically plated. In a preferred embodiment, the substrate is formed in a manner that facilitates the use of non-stick detection during wire bonding. In a distinct aspect of the invention the substrate strip has a plurality of distinct molding area tiles that each have a two dimensional array of substrate segments formed thereon. The substrate segments each have a die attach area, a plurality of landing one surface and a plurality of contact pads on the other. The contact pads are positioned substantially across from the landings and are electrically connected thereto by associated vias.