Abstract: There is provided a smart aquaculture growth and health monitoring system and method for monitoring the growth and health of an aquatic species present in an aquaculture growth habitat. The system comprises a georeferenced location beacon of the growth habitat, a sample container to sample water and aquatic species from the growth habitat and being configured to permit an electronic device having camera such as a smart phone to acquire digital visual data on said sample, a processor is communicatively linkable to the electronic device and optionally to a communications network, the processor being operable to receive the digital visual data; determine, based on the digital visual data, growth and/or health parameters of the aquatic species in the sample; and to retransmit data on the growth and/or health parameters of the aquatic species back to the electronic device.

Abstract: A heat sink pedestal device allows for the use of generic thermal units such as heat sinks. An interposer configured to fit a specific device under test is mounted to a retainer. The retainer firmly holds the interposer in position. In addition, the retainer may be mounted to a thermal unit. An interface sealant with a diameter less than that of the interposer, creating the perimeter of an interface medium chamber, is positioned at the periphery of the interposer between the interposer and the thermal unit. Interface material, having high thermal conductive properties, is positioned within the interface sealant. The interface medium chamber provides a high thermally conductive interface between the interposer and the thermal unit. In addition, the heat sink pedestal device minimizes customization because it allows a single heat sink or thermal unit assembly to be used to accommodate a wide range of unit sizes.

Abstract: A heat sink pedestal device allows for the use of generic thermal units such as heat sinks. An interposer configured to fit a specific device under test is mounted to a retainer. The retainer firmly holds the interposer in position. In addition, the retainer may be mounted to a thermal unit. An interface sealant with a diameter less than that of the interposer, creating the perimeter of an interface medium chamber, is positioned at the periphery of the interposer between the interposer and the thermal unit. Interface material, having high thermal conductive properties, is positioned within the interface sealant. The interface medium chamber provides a high thermally conductive interface between the interposer and the thermal unit. In addition, the heat sink pedestal device minimizes customization because it allows a single heat sink or thermal unit assembly to be used to accommodate a wide range of unit sizes.

Abstract: A heat sink pedestal device allows for the use of generic thermal units such as heat sinks. An interposer configured to fit a specific device under test is mounted to a retainer. The retainer firmly holds the interposer in position. In addition, the retainer may be mounted to a thermal unit. An interface sealant with a diameter less than that of the interposer, creating the perimeter of an interface medium chamber, is positioned at the periphery of the interposer between the interposer and the thermal unit. Interface material, having high thermal conductive properties, is positioned within the interface sealant. The interface medium chamber provides a high thermally conductive interface between the interposer and the thermal unit. In addition, the heat sink pedestal device minimizes customization because it allows a single heat sink or thermal unit assembly to be used to accommodate a wide range of unit sizes.

Abstract: A heat sink pedestal device allows for the use of generic thermal units such as heat sinks. An interposer configured to fit a specific device under test is mounted to a retainer. The retainer firmly holds the interposer in position. In addition, the retainer may be mounted to a thermal unit. An interface sealant with a diameter less than that of the interposer, creating the perimeter of an interface medium chamber, is positioned at the periphery of the interposer between the interposer and the thermal unit. Interface material, having high thermal conductive properties, is positioned within the interface sealant. The interface medium chamber provides a high thermally conductive interface between the interposer and the thermal unit. In addition, the heat sink pedestal device minimizes customization because it allows a single heat sink or thermal unit assembly to be used to accommodate a wide range of unit sizes.

Abstract: A combined heater and heat sink assembly regulates the temperature of a device under test. The combined heating/cooling assembly includes a heater assembly inlay that is received within a heat sink. The heater assembly includes a heating surface that is coplanar with a cooling surface of the heat sink. In operation, the heating/cooling assembly provides concurrent hot and cold contact points for the device under test. The heater assembly is thermally insulated from the heat sink such that the majority of the heat generated by the heater assembly is directly applied to the device under test; very little of the generated heat is lost to the heat sink. On the other hand, the heat sink provides a relatively low thermal resistance between the device under test and a cold source such as a coolant. Accordingly, the combined heating/cooling assembly provides parallel thermal paths between the device under test and both a hot source and a cold source.

Abstract: A combined heater and heat sink assembly regulates the temperature of a device under test. The combined heating/cooling assembly includes a heater assembly inlay that is received within a heat sink. The heater assembly includes a heating surface that is coplanar with a cooling surface of the heat sink. In operation, the heating/cooling assembly provides concurrent hot and cold contact points for the device under test. The heater assembly is thermally insulated from the heat sink such that the majority of the heat generated by the heater assembly is directly applied to the device under test; very little of the generated heat is lost to the heat sink. On the other hand, the heat sink provides a relatively low thermal resistance between the device under test and a cold source such as a coolant. Accordingly, the combined heating/cooling assembly provides parallel thermal paths between the device under test and both a hot source and a cold source.

Abstract: A combined heater and heat sink assembly regulates the temperature of a device under test. The combined heating/cooling assembly includes a heater assembly inlay that is received within a heat sink. The heater assembly includes a heating surface that is coplanar with a cooling surface of the heat sink. In operation, the heating/cooling assembly provides concurrent hot and cold contact points for the device under test. The heater assembly is thermally insulated from the heat sink such that the majority of the heat generated by the heater assembly is directly applied to the device under test; very little of the generated heat is lost to the heat sink. On the other hand, the heat sink provides a relatively low thermal resistance between the device under test and a cold source such as a coolant. Accordingly, the combined heating/cooling assembly provides parallel thermal paths between the device under test and both a hot source and a cold source.

Abstract: A combined heater and heat sink assembly regulates the temperature of a device under test. The combined heating/cooling assembly includes a heater assembly inlay that is received within a heat sink. The heater assembly includes a heating surface that is coplanar with a cooling surface of the heat sink. In operation, the heating/cooling assembly provides concurrent hot and cold contact points for the device under test. The heater assembly is thermally insulated from the heat sink such that the majority of the heat generated by the heater assembly is directly applied to the device under test; very little of the generated heat is lost to the heat sink. On the other hand, the heat sink provides a relatively low thermal resistance between the device under test and a cold source such as a coolant. Accordingly, the combined heating/cooling assembly provides parallel thermal paths between the device under test and both a hot source and a cold source.