Patents by Inventor Thanh-Vi TRAN
Thanh-Vi TRAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11892205Abstract: A heat pump that includes a thermoelectric device(s) and a heat sink having a raised portion with a top surface for thermally coupling with a planar face of the thermoelectric device(s). The raised portion of the heat sink includes an outer periphery and a raised central region surrounded by a void region to provide more uniform thermal conductivity when clamped within an assembly. The raised central region is shaped in an any shape corresponding to a shape of uneven thermal conductivity due to clamping pressure applied to the heat sink. The void region can be substantially contiguous and entirely circumscribe the central raised region. The device can optionally include discrete supports formed of a less thermally-conductive material within the void region. The supports can be elastomeric, such as O-rings, and disposed within pockets defined within the void region.Type: GrantFiled: November 18, 2022Date of Patent: February 6, 2024Assignee: Bio-Rad Laboratories, Inc.Inventors: Amir Sadri, Nenad Kircanski, Thanh-Vi Tran, Carl Marlowe, Brian David Wilson
-
Patent number: 11690169Abstract: A thermal management system that include an electronic circuit boards having at least two circuit boards with a space in between and further includes one or more air tubes or conduits. The electronic circuit board and air tubes are configured for drawing air into the space to facilitate cooling of the electronic circuit board concurrent with cooling of a heat sink of a heat pump connected with the electronic circuit board. The system can further include a partition to isolate airflow from the heat sink from airflow through the electronics circuit board, and can further include one or more interface components for maintaining isolation and control of air flow, improving air intake and/or supporting auxiliary components.Type: GrantFiled: June 16, 2022Date of Patent: June 27, 2023Assignee: Bio-Rad Laboratories, Inc.Inventors: Amir Sadri, Neven Nikolic, Gabriel Culinco, Thanh-Vi Tran, Nenad Kircanski
-
Publication number: 20230152011Abstract: A heat pump that includes a thermoelectric device(s) and a heat sink having a raised portion with a top surface for thermally coupling with a planar face of the thermoelectric device(s). The raised portion of the heat sink includes an outer periphery and a raised central region surrounded by a void region to provide more uniform thermal conductivity when clamped within an assembly. The raised central region is shaped in an any shape corresponding to a shape of uneven thermal conductivity due to clamping pressure applied to the heat sink. The void region can be substantially contiguous and entirely circumscribe the central raised region. The device can optionally include discrete supports formed of a less thermally-conductive material within the void region. The supports can be elastomeric, such as O-rings, and disposed within pockets defined within the void region.Type: ApplicationFiled: November 18, 2022Publication date: May 18, 2023Inventors: Amir SADRI, Nenad KIRCANSKI, Thanh-Vi TRAN, Carl MARLOWE, Brian David WILSON
-
Patent number: 11549731Abstract: A heat pump that includes a thermoelectric device(s) and a heat sink having a raised portion with a top surface for thermally coupling with a planar face of the thermoelectric device(s). The raised portion of the heat sink includes an outer periphery and a raised central region surrounded by a void region to provide more uniform thermal conductivity when clamped within an assembly. The raised central region is shaped in an any shape corresponding to a shape of uneven thermal conductivity due to clamping pressure applied to the heat sink. The void region can be substantially contiguous and entirely circumscribe the central raised region. The device can optionally include discrete supports formed of a less thermally-conductive material within the void region. The supports can be elastomeric, such as O-rings, and disposed within pockets defined within the void region.Type: GrantFiled: January 2, 2020Date of Patent: January 10, 2023Assignee: Bio-Rad Laboratories, Inc.Inventors: Amir Sadri, Nenad Kircanski, Thanh-Vi Tran, Carl Marlowe, Brian David Wilson
-
Publication number: 20220312586Abstract: A thermal management system that include an electronic circuit boards having at least two circuit boards with a space in between and further includes one or more air tubes or conduits. The electronic circuit board and air tubes are configured for drawing air into the space to facilitate cooling of the electronic circuit board concurrent with cooling of a heat sink of a heat pump connected with the electronic circuit board. The system can further include a partition to isolate airflow from the heat sink from airflow through the electronics circuit board, and can further include one or more interface components for maintaining isolation and control of air flow, improving air intake and/or supporting auxiliary components.Type: ApplicationFiled: June 16, 2022Publication date: September 29, 2022Inventors: Amir SADRI, Neven NIKOLIC, Gabriel CULINCO, Thanh-Vi TRAN, Nenad KIRCANSKI
-
Patent number: 11375612Abstract: A thermal management system that include an electronic circuit boards having at least two circuit boards with a space in between and further includes one or more air tubes or conduits. The electronic circuit board and air tubes are configured for drawing air into the space to facilitate cooling of the electronic circuit board concurrent with cooling of a heat sink of a heat pump connected with the electronic circuit board. The system can further include a partition to isolate airflow from the heat sink from airflow through the electronics circuit board, and can further include one or more interface components for maintaining isolation and control of air flow, improving air intake and/or supporting auxiliary components.Type: GrantFiled: November 23, 2020Date of Patent: June 28, 2022Assignee: Bio-Rad Laboratories, Inc.Inventors: Amir Sadri, Neven Nikolic, Gabriel Culinco, Thanh-Vi Tran, Nenad Kircanski
-
Publication number: 20210161003Abstract: A thermal management system that include an electronic circuit boards having at least two circuit boards with a space in between and further includes one or more air tubes or conduits. The electronic circuit board and air tubes are configured for drawing air into the space to facilitate cooling of the electronic circuit board concurrent with cooling of a heat sink of a heat pump connected with the electronic circuit board. The system can further include a partition to isolate airflow from the heat sink from airflow through the electronics circuit board, and can further include one or more interface components for maintaining isolation and control of air flow, improving air intake and/or supporting auxiliary components.Type: ApplicationFiled: November 23, 2020Publication date: May 27, 2021Inventors: Amir SADRI, Neven NIKOLIC, Gabriel CULINCO, Thanh-Vi TRAN, Nenad KIRCANSKI
-
Publication number: 20200224936Abstract: A heat pump that includes a thermoelectric device(s) and a heat sink having a raised portion with a top surface for thermally coupling with a planar face of the thermoelectric device(s). The raised portion of the heat sink includes an outer periphery and a raised central region surrounded by a void region to provide more uniform thermal conductivity when clamped within an assembly. The raised central region is shaped in an any shape corresponding to a shape of uneven thermal conductivity due to clamping pressure applied to the heat sink. The void region can be substantially contiguous and entirely circumscribe the central raised region. The device can optionally include discrete supports formed of a less thermally-conductive material within the void region. The supports can be elastomeric, such as O-rings, and disposed within pockets defined within the void region.Type: ApplicationFiled: January 2, 2020Publication date: July 16, 2020Inventors: Amir Sadri, Nenad Kircanski, Thanh-Vi Tran, Carl Marlowe, Brian David Wilson
-
Publication number: 20180299476Abstract: Fraction collector dispensers and methods of using such dispensers are provided. In one embodiment, the dispenser includes an inlet for receiving liquid from a liquid source, wherein the inlet is in fluid communication with an outlet from which liquid is dispensed into a receptacle; and a reservoir in fluid communication with a flow path between the inlet and outlet, wherein the reservoir is configured to receive liquid during movement of the dispenser between receptacles or during movement of receptacles between dispense positions and to receive pressurized air or gas to empty liquid out of the reservoir before or after movement of the dispenser or receptacles, wherein the dispenser is moveable between a first receptacle and a second receptacle or the receptacles are moveable between dispense positions.Type: ApplicationFiled: April 2, 2018Publication date: October 18, 2018Inventors: Nenad KIRCANSKI, Wen-I WU, Amir SADRI, Manja KIRCANSKI, Neven NIKOLIC, Thanh-Vi TRAN