Patents by Inventor Thanikaivelan Tindivanam Veeraraghavan

Thanikaivelan Tindivanam Veeraraghavan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250171654
    Abstract: A storage stable, one-component, solvent-free, non-halogenated, heat curable composition which cures to form a cured product for use in encapsulation of electrical components, including: (a) an epoxy resin; (b) a non-halogenated flame retardant based on phosphorus containing epoxy resin; (c) a cyclic anhydride hardening agent; (d) a catalyst; (e) a rheology modifier; (f) a heat stabilizing agent; and (g) wherein the composition is fast gelling/curing and exhibits a high glass transition temperature, and excellent mechanical, electrical, and flame-retardant properties.
    Type: Application
    Filed: November 29, 2023
    Publication date: May 29, 2025
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Karthikeyan Sengotaiyan, Senthilkumar Veeraraghavan
  • Patent number: 12291619
    Abstract: A reinforcing sheet including one or more layers of a reinforcing material, and a thermosetting adhesive associated with the reinforcing material, wherein the thermosetting adhesive includes a curing agent, and an epoxy-modified dimerized fatty acid combined with an epoxy terminated polyurethane interpenetrating network.
    Type: Grant
    Filed: February 20, 2024
    Date of Patent: May 6, 2025
    Assignee: Uniseal, Inc.
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Ramanathan Lakshminarayan, Brandon Allen Willis
  • Publication number: 20250101275
    Abstract: A pumpable, one-component, curable, anti-flutter composition which cures to form a cured product, including: (a) an elastomer; (b) a homopolymer resin; (c) a novel thixotropic filler system; and (d) wherein the anti-flutter composition exhibits high wash resistance.
    Type: Application
    Filed: September 26, 2023
    Publication date: March 27, 2025
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Senthilkumar Veeraraghavan, Karthikeyan Sengotaiyan
  • Publication number: 20250051620
    Abstract: One-component electromagnetic curable novel toughened epoxy-hybrid structural adhesives, generally including: (a) a bisphenol A liquid epoxy resin, (b) a bisphenol F liquid epoxy resin, (c) a bisphenol A solid epoxy resin, (d) a novel toughening agent, (e) one or more mineral fillers, and (f) a curing agent. The structural adhesives of the present invention can be cured within seconds and are useful for a plurality of applications, including bonding OEM closure panel components, such as doors, hoods, fenders, etcetera.
    Type: Application
    Filed: September 30, 2024
    Publication date: February 13, 2025
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Ramanathan Lakshminarayan
  • Publication number: 20250043163
    Abstract: A one-component curable structural adhesive composition which cures to form a cured product, including a hybrid epoxy resin system and a silane adhesion promoter, wherein the structural adhesive composition is low energy curable (e.g., capable of curing at temperatures below 140° C. in 15 minutes or less), and the cured product is crash durable and exhibits high wash resistance.
    Type: Application
    Filed: August 4, 2023
    Publication date: February 6, 2025
    Inventor: Thanikaivelan Tindivanam Veeraraghavan
  • Publication number: 20250043144
    Abstract: A non-aqueous sprayable and curable dampening composition for automotive body and closure panels which cures to form a cured product, including: (1) a PVC homopolymer resin and/or a mixture of a PVC copolymer resin; (2) a phthalate plasticizer and a benzoate plasticizer; (3) a filler component, wherein the filler component comprises one or more spherical fillers and/or one or more platy fillers; (4) a modified epoxy resin; (5) an adhesion promoter; and (6) a substrate wetting agent.
    Type: Application
    Filed: August 4, 2023
    Publication date: February 6, 2025
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Karthikeyan Sengotaiyan, Senthilkumar Veeraraghavan
  • Patent number: 12110425
    Abstract: One-component electromagnetic curable novel toughened epoxy-hybrid structural adhesives, generally including: (a) a bisphenol A liquid epoxy resin, (b) a bisphenol F liquid epoxy resin, (c) a bisphenol A solid epoxy resin, (d) a novel toughening agent, (e) one or more mineral fillers, and (f) a curing agent. The structural adhesives of the present invention can be cured within seconds and are useful for a plurality of applications, including bonding OEM closure panel components, such as doors, hoods, fenders, etcetera.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: October 8, 2024
    Assignee: Uniseal, Inc.
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Ramanathan Lakshminarayan
  • Publication number: 20240228719
    Abstract: A reinforcing sheet including one or more layers of a reinforcing material, and a thermosetting adhesive associated with the reinforcing material, wherein the thermosetting adhesive includes a curing agent, and an epoxy-modified dimerized fatty acid combined with an epoxy terminated polyurethane interpenetrating network.
    Type: Application
    Filed: February 20, 2024
    Publication date: July 11, 2024
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Ramanathan Lakshminarayan, Brandon Allen Willis
  • Publication number: 20240209243
    Abstract: A two-part curable composition which cures to form a thermally conductive cured product, including: a first-part having: (1) a maleic anhydride adducted polybutadiene component; (2) a non-reactive diluent component; (3) a wetting agent component; and (4) a filler component; and a second-part having: (1) a hydroxyl terminated polybutadiene component; (2) a catalytic component for catalyzing the cure reaction; (3) a diluent component; (4) a filler component; and (5) a wetting agent component, wherein at least one of the filler components of the first-part and the second-part comprises a thermally conductive filler. The compositions of the present invention are useful for bonding heat generating components, such as, for example, automotive electrical battery pack components, high-capacity batteries and electric motors in electric and hybrid vehicles.
    Type: Application
    Filed: June 7, 2021
    Publication date: June 27, 2024
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Senthilkumar Veeraraghavan, Karthikeyan Sengotaiyan
  • Patent number: 11905384
    Abstract: A reinforcing sheet including one or more layers of a reinforcing material, and a thermosetting adhesive associated with the reinforcing material, wherein the thermosetting adhesive includes a curing agent, and an epoxy-modified dimerized fatty acid combined with an epoxy terminated polyurethane interpenetrating network.
    Type: Grant
    Filed: February 28, 2023
    Date of Patent: February 20, 2024
    Assignee: Uniseal, Inc.
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Ramanathan Lakshminarayan, Brandon Allen Willis
  • Publication number: 20240043676
    Abstract: A low temperature curable anti-flutter composition which cures to form a cured product, including: (a) a first copolymer, wherein the first copolymer comprises a rubber having at least one nitrile functional group; and (b) a second copolymer, wherein the second copolymer comprises a rubber having styrene-butadiene functional groups, wherein the composition is a room temperature pumpable sealant which is capable of expanding and curing at temperatures below 140° C. in less than 15 minutes.
    Type: Application
    Filed: July 28, 2022
    Publication date: February 8, 2024
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Karthikeyan Sengotaiyan, Senthilkumar Veeraraghavan
  • Publication number: 20230331948
    Abstract: A reinforcing sheet including one or more layers of a reinforcing material, and a thermosetting adhesive associated with the reinforcing material, wherein the thermosetting adhesive includes a curing agent, and an epoxy-modified dimerized fatty acid combined with an epoxy terminated polyurethane interpenetrating network.
    Type: Application
    Filed: February 28, 2023
    Publication date: October 19, 2023
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Ramanathan Lakshminarayan, Brandon Allen Willis
  • Publication number: 20230183425
    Abstract: A two-part curable composition which cures to form a thermally conductive cured product, including: (a) a first part including: (1) at least one metal catalytic component for catalyzing the cure reaction; (2) a non-reactive diluent component; (3) a wetting agent component; (4) a filler component; (5) a rheology modifier component; and (6) a pigment component; and (b) a second part including: (1) at least one silane terminated polyurethane polymer; (2) a moisture scavenger; (3) a non-reactive diluent component; (4) a filler component; and (5) a wetting agent component, wherein at least one of the filler components of the first-part and the second-part comprises a thermally conductive filler.
    Type: Application
    Filed: December 10, 2021
    Publication date: June 15, 2023
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Karthikeyan Sengotaiyan, Senthilkumar Veeraraghavan
  • Publication number: 20230074509
    Abstract: One-component electromagnetic curable novel toughened epoxy-hybrid structural adhesives, generally including: (a) a bisphenol A liquid epoxy resin, (b) a bisphenol F liquid epoxy resin, (c) a bisphenol A solid epoxy resin, (d) a novel toughening agent, (e) one or more mineral fillers, and (f) a curing agent. The structural adhesives of the present invention can be cured within seconds and are useful for a plurality of applications, including bonding OEM closure panel components, such as doors, hoods, fenders, etcetera.
    Type: Application
    Filed: August 17, 2021
    Publication date: March 9, 2023
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Ramanathan Lakshminarayan
  • Patent number: 11591447
    Abstract: A reinforcing sheet including one or more layers of a reinforcing material, and a thermosetting adhesive associated with the reinforcing material, wherein the thermosetting adhesive includes a curing agent, and an epoxy-modified dimerized fatty acid combined with an epoxy terminated polyurethane interpenetrating network.
    Type: Grant
    Filed: May 24, 2022
    Date of Patent: February 28, 2023
    Assignee: Uniseal, Inc.
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Ramanathan Lakshminarayan, Brandon Allen Willis
  • Publication number: 20220389181
    Abstract: A reinforcing sheet including one or more layers of a reinforcing material, and a thermosetting adhesive associated with the reinforcing material, wherein the thermosetting adhesive includes a curing agent, and an epoxy-modified dimerized fatty acid combined with an epoxy terminated polyurethane interpenetrating network.
    Type: Application
    Filed: May 24, 2022
    Publication date: December 8, 2022
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Ramanathan Lakshminarayan, Brandon Allen Willis
  • Patent number: 11339262
    Abstract: A reinforcing sheet including one or more layers of a reinforcing material, and a thermosetting adhesive associated with the reinforcing material, wherein the thermosetting adhesive includes a curing agent, and an epoxy-modified dimerized fatty acid combined with an epoxy terminated polyurethane interpenetrating network.
    Type: Grant
    Filed: November 5, 2018
    Date of Patent: May 24, 2022
    Assignee: Uniseal, Inc.
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Ramanathan Lakshminarayan, Brandon Allen Willis
  • Publication number: 20220041898
    Abstract: A substrate assembly, including: (a) a first substrate; (b) a second substrate; and (c) a thermosetting adhesive associated with at least a portion of the first and second substrates, wherein the thermosetting adhesive includes a curing agent, and an epoxy-modified dimerized fatty acid combined with an epoxy terminated polyurethane interpenetrating network.
    Type: Application
    Filed: August 6, 2020
    Publication date: February 10, 2022
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Ramanathan Lakshminarayan, Brandon Allen Willis
  • Publication number: 20190153182
    Abstract: A reinforcing sheet including one or more layers of a reinforcing material, and a thermosetting adhesive associated with the reinforcing material, wherein the thermosetting adhesive includes a curing agent, and an epoxy-modified dimerized fatty acid combined with an epoxy terminated polyurethane interpenetrating network.
    Type: Application
    Filed: November 5, 2018
    Publication date: May 23, 2019
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Ramanathan Lakshminarayan, Brandon Allen Willis