Patents by Inventor The?apos; Ling Nguyen

The?apos; Ling Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Submount, pedestal, and bond wire assembly for a transistor outline package with reduced bond wire inductance
    Publication number: 20030218923
    Abstract: The present invention relates generally to optoelectronic devices, and particularly to a submount, pedestal, and bond wire assembly for a transistor outline package. A bottom surface of the submount is connected to a top surface of the pedestal. Each bond wire in a bond wire set is connected to a position on the top surface of the submount, and to a position on the signal line. The signal line is positioned a first distance from the position on the top surface of the submount and a second distance from the pedestal. The submount is sized such that a portion of the bottom and the top surface of the submount extends beyond the top surface of the pedestal such that the first distance is less than the second distance.
    Type: Application
    Filed: March 19, 2003
    Publication date: November 27, 2003
    Applicant: Finisar Corporation
    Inventors: Giorgio Giaretta, The?apos; Ling Nguyen, Jan Lipson, Rudolf J. Hofmeister