Patents by Inventor The-hoa Lai

The-hoa Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microlead for multipoint neuromodulation of the central nervous system
    Patent number: 10183161
    Abstract: A microlead, of an overall diameter less than 0.5 mm, includes a plurality of at least eight conductor wires individually insulated and twisted together. Each conductor wire includes an electrically conductive core microcable and an insulation layer surrounding the core microcable and having at least one exposed area to form a detection/stimulation electrode of the microlead. The microlead further includes a central support structure shaped as a surface of revolution, which may be free of conductor wires and of central lumen. The conductor wires are configured in one or more layers of twisted peripheral conductor wires carried by the central support structure and circumferentially distributed thereon.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: January 22, 2019
    Assignee: Sorin CRM SAS
    Inventors: Nicolas Shan, The-hoa Lai
  • MICROLEAD FOR MULTIPOINT NEUROMODULATION OF THE CENTRAL NERVOUS SYSTEM
    Publication number: 20180221652
    Abstract: A microlead, of an overall diameter less than 0.5 mm, includes a plurality of at least eight conductor wires individually insulated and twisted together. Each conductor wire includes an electrically conductive core microcable and an insulation layer surrounding the core microcable and having at least one exposed area to form a detection/stimulation electrode of the microlead. The microlead further includes a central support structure shaped as a surface of revolution, which may be free of conductor wires and of central lumen. The conductor wires are configured in one or more layers of twisted peripheral conductor wires carried by the central support structure and circumferentially distributed thereon.
    Type: Application
    Filed: April 6, 2018
    Publication date: August 9, 2018
    Applicant: SORIN CRM SAS
    Inventors: Nicolas Shan, The-hoa Lai
  • Microlead for multipoint neuromodulation of the central nervous system
    Patent number: 9937340
    Abstract: A microlead, of an overall diameter less than 0.5 mm, includes a plurality of at least eight conductor wires individually insulated and twisted together. Each conductor wire includes an electrically conductive core microcable and an insulation layer surrounding the core microcable and having at least one exposed area to form a detection/stimulation electrode of the microlead. The microlead further includes a central support structure shaped as a surface of revolution, which may be free of conductor wires and of central lumen. The conductor wires are configured in one or more layers of twisted peripheral conductor wires carried by the central support structure and circumferentially distributed thereon.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: April 10, 2018
    Assignee: SORIN CRM SAS
    Inventors: Nicolas Shan, The-hoa Lai
  • MICROLEAD FOR MULTIPOINT NEUROMODULATION OF THE CENTRAL NERVOUS SYSTEM
    Publication number: 20160235967
    Abstract: A microlead, of an overall diameter less than 0.5 mm, includes a plurality of at least eight conductor wires individually insulated and twisted together. Each conductor wire includes an electrically conductive core microcable and an insulation layer surrounding the core microcable and having at least one exposed area to form a detection/stimulation electrode of the microlead. The microlead further includes a central support structure shaped as a surface of revolution, which may be free of conductor wires and of central lumen. The conductor wires are configured in one or more layers of twisted peripheral conductor wires carried by the central support structure and circumferentially distributed thereon.
    Type: Application
    Filed: February 16, 2016
    Publication date: August 18, 2016
    Inventors: Nicolas Shan, The-hoa Lai