Abstract: An over-current protection device includes first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, and a conductive filler. The polymer matrix has a fluoropolymer. The total volume of the PTC material layer is calculated as 100%, and the fluoropolymer accounts for 47-62% by volume of the PTC material layer. The fluoropolymer has a melt viscosity higher than 3000 Pa·s.

Abstract: A porous biochar for improving heavy pollution and a method for producing the same. Said porous biochar is prepared as follows: arrowhead, which has excellent enrichment of lead, is used to absorb heavy metal lead in polluted water or artificial wetlands, simultaneously absorb heavy metal cadmium, thereafter is dried and treated as a biomass, and then the biomass is calcined in stages with a passivating agent in a high temperature environment, so as to heavy metals such as lead and cadmium be stably coated or enriched in a biochar, which is mixed with Pseudomonas aeruginosa having high resistant, to obtain the porous biochar; the porous biochar has high specific surface area, high porosity and excellent mechanical properties, is very stable under different acid-base environments and oxidizing conditions.

Abstract: A composite biochar for controlling heavy metal pollution and a process for producing the same, in particular enrichment of heavy metals such as arsenic and lead in soil with centipede grass, thereafter centipede grass is sintered with hydroxyapatite, sepiolite and chitosan, and compounded with microorganisms to produce said composite biochar; through the process of the present invention, heavy metals such as arsenic and lead are stably enriched or coated in said composite biochar, significantly reducing the potential hazard of arsenic and lead to the environment, and also providing new developmental ideas for treating heavy metal biomass.

Abstract: Methods and semiconductor devices are provided. A method includes determining a location of a polyimide opening (PIO) corresponding to an under-bump metallization (UBM) feature in a die. The die includes a substrate and an interconnect structure over the substrate. The method also includes determining a location of a stacked via structure in the interconnect structure based on the location of the PIO. The method further includes forming, in the interconnect structure, the stacked via structure comprising at most three stacked contact vias at the location of the PIO.

Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a polymer matrix and a first conductive filler. The polymer matrix includes a polyolefin-based polymer and a fluoropolymer. The fluoropolymer has a melt flow index higher than 1.9 g/10 min, and the polyolefin-based polymer and the fluoropolymer together form an interpenetrating polymer network (IPN). The first conductive filler has a metal-ceramic compound dispersed in the polymer matrix.

Abstract: In a method for obtaining the equivalent oxide thickness of a dielectric layer, a first semiconductor capacitor including a first silicon dioxide layer and a second semiconductor capacitor including a second silicon dioxide layer are provided and a modulation voltage is applied to the semiconductor capacitors to measure a first scanning capacitance microscopic signal and a second scanning capacitance microscopic signal. According to the equivalent oxide thicknesses of the silicon dioxide layers and the scanning capacitance microscopic signals, an impedance ratio is calculated. The modulation voltage is applied to a third semiconductor capacitor including a dielectric layer to measure a third scanning capacitance microscopic signal. Finally, the equivalent oxide thickness of the dielectric layer is obtained according to the equivalent oxide thickness of the first silicon dioxide layer, the first scanning capacitance microscopic signal, third scanning capacitance microscopic signal, and the impedance ratio.

Abstract: Semiconductor devices and methods of forming the same are provided. In some embodiments, a method includes receiving a workpiece having a redistribution layer disposed over and electrically coupled to an interconnect structure. In some embodiments, the method further includes patterning the redistribution layer to form a recess between and separating a first conductive feature and a second conductive feature of the redistribution layer, where corners of the first conductive feature and the second conductive feature are defined adjacent to and on either side of the recess. The method further includes depositing a first dielectric layer over the first conductive feature, the second conductive feature, and within the recess. The method further includes depositing a nitride layer over the first dielectric layer. In some examples, the method further includes removing portions of the nitride layer disposed over the corners of the first conductive feature and the second conductive feature.

Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 48% to 55%. The conductive filler has a metal-ceramic compound.

Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 33% to 42%.

Abstract: The battery pack with the plurality of batteries is determined to have been fully charged and set in a stationary state, the discharge operation proceeds according to specified relationships of the voltage of each battery, a first predetermined voltage difference, and a discharge starting voltage, or the balance operation proceeds according to specified relationships of the voltage of each battery, the first predetermined voltage difference, a balance starting voltage and a second predetermined voltage difference.

Abstract: An elastic physiological patch includes a patch assembly and an implant assembly. The patch assembly includes an electronic device, and a soft patch body defining a chamber for receiving the electronic device. The implant assembly is mountable to the electronic device and includes an implant which is capable of being driven to partially pass through the patch body and which is adapted to be implanted in the skin of a subject. The implant and the patch body cooperatively seal the chamber.

Abstract: The present invention provides a protection circuit applied to a battery module, which includes a self-control protector, a switch element and a voltage clamping loop; the self-control protector includes a fuse unit and a heater; when the switch element receives a control signal, the switch element will be turned on; when the switch element is turned on, the voltage clamping loop provides a clamp voltage to clamp a working current passing through the self-control protector within a current range where the fuse unit can be blown; and as such, the fuse unit of the self-control protector will be blown by the working current heating the heater.

Abstract: A method for estimating a length of underwater creatures and a system for estimating a length of underwater creatures are provided. The system includes a memory and a processor. The processor is electrically connected to the memory to load instructions in the memory to perform the method. The method includes: receiving a underwater image, in which the underwater image is captured by an image capturing device and includes a creature pattern of a target creature; performing an identification step on the creature pattern to obtain a creature lightness data set corresponding to the target creature; calculating a creature distance between the target creature and the image capturing device. In some embodiments, the identification step further obtains a creature structure data set of the target creature, and thus a creature length of the target creature is calculated in accordance with the creature distance and the creature structure data set.

Abstract: A method of increasing the resistivity of a silicon carbide wafer includes providing a silicon carbide wafer with a first resistivity, and applying a microwave to treat the silicon carbide wafer. The treated silicon carbide wafer has a second resistivity. The second resistivity is higher than the first resistivity. The microwave treated silicon carbide wafer can be applied in a high-frequency device.

Abstract: A cord lock may include a first main body, two sliding blocks, two pressing members, a cord, and a shell. The first main body has two first through holes and a sliding rail, and each of the two first through holes extended vertically has an oval cross section and the two first through holes are laterally symmetrical, and the sliding rail is adapted to penetrate through two lateral ends of the first main body horizontally. The two sliding blocks horizontally movable in the sliding rail of the first main body are movable in the two first through holes respectively.

Abstract: A method of forming a protective film on at least one electronic module is provided. The method includes the following steps. A protective material is disposed on at least one electronic module such that the protective material and the electronic modules are in contact with each other. The electronic modules and the protective material disposed on the electronic modules are disposed in a chamber, and a first ambient pressure is provided in the chamber. The protective material in the chamber is heated to a first temperature to soften the protective material disposed on the electronic modules. After the protective material is softened, a second ambient pressure greater than the first ambient pressure is provided in the chamber, wherein a gas in the chamber directly pressurizes the protective material such that the protective material conformally covers a top of the electronic modules.

Abstract: A smart aquaculture method is provided for an aquaculture system including a breeding pool, a feeding machine and a camera disposed in the breeding pool. The method includes: taking an underwater image by the camera; calculating a feed remaining amount according to the underwater image; and controlling the feeding machine according to the feed remaining amount to dispense feed to the breeding pool.

Abstract: A vacuum lamination system includes a film supply assembly, a film collection assembly, a lower lamination body, an upper lamination body, an air extractor, a moving assembly and a cutting assembly. The lower lamination body includes a first casing base and a lower heating assembly vertically movable and disposed in the first casing base. The lower heating assembly carries and moves the substrate so that the substrate is substantially flush with a top surface of the first casing base or retracted into the first casing base. The upper lamination body is vertically movable and disposed above the lower lamination body and includes an upper casing and an upper heating assembly disposed on the upper casing. The air extractor is connected to the lower lamination body. The moving assembly changes a height of a portion of the film. The cutting assembly cuts a portion of the film laminated onto the substrate.

Abstract: A method and apparatus for performing dynamic recovery management regarding a RAID are provided. The method includes: writing a first set of protected data into a first protected access unit of multiple protected access units of the RAID, and recording a first set of management information corresponding to the first set of protected data, for data recovery of the first set of protected data; and when any storage device of multiple storage devices of the RAID malfunctions, writing a second set of protected data into a second protected access unit of the protected access units, and recording a second set of management information corresponding to the second set of protected data, for data recovery of the second set of protected data. Any set of the first set of protected data and the second set of protected data includes data and multiple parity-check codes.

Abstract: A method and apparatus for performing mapping information management regarding a RAID are provided. The method includes: writing data into a data region of the RAID in a redirect-on-write (ROW) manner, and recording mapping information between logical addresses of the data and protected-access-unit addresses (p-addresses) of protected access units in the data region into a logical-address-to-p-address (L2p) table within a table region of the RAID; when partial data of the data is updated, maintaining an updating list including a set of L2p table entries for the partial data in a RAM, and maintaining a recovery log corresponding to the updating list in a log region of the RAID, for power failure recovery; and according to the updating list, detecting whether a number of same-location L2p table entries in the set of L2p table entries reaches a predetermined threshold, to selectively update the L2p table with the same-location L2p table entries.