Patents by Inventor Theethira Kushalappa Poovanna

Theethira Kushalappa Poovanna has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Encapsulated RFID tags and methods of making same
    Patent number: 8643492
    Abstract: Encapsulated radio frequency identification (RFID) articles having enhanced break strength and/or temperature resistance and methods of making these articles. The RFID articles include an RFID tag embedded within a thermoplastic substrate to form the RFID article. In one embodiment, the RFID article includes an over-molded barrier material that enables the RFID article to have enhanced temperature resistance such that the articles are able top sustain repeated exposure to high temperatures and/or sterilization procedures, thereby enabling the RFID articles to be utilized in applications heretofore unavailable. In other embodiments, the RFID articles are made using an injection molding process that provides very thin encapsulated RFID tags that also exhibit an increased level of temperature resistance.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: February 4, 2014
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Sudhakar R. Marur, Theethira Kushalappa Poovanna, Venkatesha Narayanaswamy
  • ENCAPSULATED RFID TAGS AND METHODS OF MAKING SAME
    Publication number: 20120318877
    Abstract: Encapsulated radio frequency identification (RFID) articles having enhanced break strength and/or temperature resistance and methods of making these articles. The RFID articles include an RFID tag embedded within a thermoplastic substrate to form the RFID article. In one embodiment, the RFID article includes an over-molded barrier material that enables the RFID article to have enhanced temperature resistance such that the articles are able top sustain repeated exposure to high temperatures and/or sterilization procedures, thereby enabling the RFID articles to be utilized in applications heretofore unavailable. In other embodiments, the RFID articles are made using an injection molding process that provides very thin encapsulated RFID tags that also exhibit an increased level of temperature resistance.
    Type: Application
    Filed: August 30, 2012
    Publication date: December 20, 2012
    Applicant: SABIC INNOVATIVE PLASTICS IP B.V.
    Inventors: Sudhakar R. Marur, Theethira Kushalappa Poovanna, Venkatesha Narayanaswamy
  • Encapsulated RFID tags and methods of making same
    Patent number: 8325047
    Abstract: Encapsulated radio frequency identification (RFID) articles having enhanced break strength and/or temperature resistance and methods of making these articles. The RFID articles include an RFID tag embedded within a thermoplastic substrate to form the RFID article. In one embodiment, the RFID article includes an over-molded barrier material that enables the RFID article to have enhanced temperature resistance such that the articles are able to sustain repeated exposure to high temperatures and/or sterilization procedures, thereby enabling the RFID articles to be utilized in applications heretofore unavailable. In other embodiments, the RFID articles are made using an injection molding process that provides very thin encapsulated RFID tags that also exhibit an increased level of temperature resistance.
    Type: Grant
    Filed: April 8, 2009
    Date of Patent: December 4, 2012
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Sudhakar Ramamoorthy Marur, Theethira Kushalappa Poovanna, Venkatesha Narayanaswamy
  • ENCAPSULATED RFID TAGS AND METHODS OF MAKING SAME
    Publication number: 20100259393
    Abstract: Encapsulated radio frequency identification (RFID) articles having enhanced break strength and/or temperature resistance and methods of making these articles. The RFID articles include an RFID tag embedded within a thermoplastic substrate to form the RFID article. In one embodiment, the RFID article includes an over-molded barrier material that enables the RFID article to have enhanced temperature resistance such that the articles are able to sustain repeated exposure to high temperatures and/or sterilization procedures, thereby enabling the RFID articles to be utilized in applications heretofore unavailable. In other embodiments, the RFID articles are made using an injection molding process that provides very thin encapsulated RFID tags that also exhibit an increased level of temperature resistance.
    Type: Application
    Filed: April 8, 2009
    Publication date: October 14, 2010
    Inventors: Sudhakar R. Marur, Theethira Kushalappa Poovanna, Venkatesha Narayanaswamy