Abstract: A flat panel display, such as a head mounted display, and a process for its manufacture are disclosed. Essentially, the flat panel display comprises separately manufactured flat panels including a display material and driver chips that are bump-bonded to the flat panels preferably by using flip chip technology. The flat panel display is particularly applicable to miniature display applications and is characterized by being rugged yet reliable, in color but with good luminescence across the spectrum of the primary colors of red, blue and green. Pixels preferably are addressed by passive matrix activation. Preferably, the display material of the flat panels is a thin film electroluminescent material, a passive matrix liquid crystal material, a plasma display material or a field emission display material.