Patents by Inventor Theng Wei

Theng Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070262030
    Abstract: A slurry strainer for tungsten CMP. It is made of PVDF and has a lower, plug portion for close fitting into the top of a drain and an upper, convex portion that sits on top of the drain, with a larger diameter than the drain itself. Debris rolls off the top of the strainer, rather than blocking its through-holes. A lip around the edge improves air flow.
    Type: Application
    Filed: September 24, 2003
    Publication date: November 15, 2007
    Applicant: Systems on Silicon Manufacturing Co. Pte. Ltd.
    Inventors: Koh Meng Fei, Poh Choon Siong, Leong Theng Wei
  • Patent number: 7201642
    Abstract: The present invention relates generally to the field of chemical/mechanical polishing of substrates. In particular the invention relates to methods of producing improved membranes for use in chemical/mechanical polishing systems. The present invention provides a method of improving the properties of a flexible membrane for use in chemical/mechanical polishing, the method including subjecting the membrane to elevated temperatures.
    Type: Grant
    Filed: June 14, 2004
    Date of Patent: April 10, 2007
    Assignee: Systems on Silicon Manufacturing Co. Pte. Ltd.
    Inventors: Meng Fei Koh, Choon Siong Poh, Inn Swee Goh, Theng Wei Leong, Teck Leong Neo, Bing Wang
  • Publication number: 20060245138
    Abstract: A perforated plate for use in a wafer-handling chuck has a pattern of through holes by which a vacuum is applied to a membrane to form suctions cups that secure a wafer to the chuck. Grooves in a generally planar upper surface of the plate interconnect the through holes. The grooves ensure the maintenance of the vacuum, and the consequent formation of the membrane suction cups, at each through hole, even when the grooved surface of the plate is in close face-to-face contact with another planar surface in the chuck. In one embodiment, the through holes in the perforated plate lie on concentric circles and the grooves interconnect radially-outward through holes to the next closest one or pair or radially-inward through holes.
    Type: Application
    Filed: July 14, 2003
    Publication date: November 2, 2006
    Inventors: Meng Koh, Choon Poh, Teck Leong, Theng Wei, Bing Wang