Patents by Inventor Theo Geussens

Theo Geussens has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230303737
    Abstract: In various embodiments, a bimodal polyethylene may include a high molecular weight component and a low molecular weight component. The bimodal polyethylene may have a density of from 0.933 grams per centimeter (g/cm3) to 0.960 g/cm3, a melt index (I2) of from 0.3 decigrams per minute (dg/min) to 1.2 dg/min, a melt flow ratio (MFR21) greater than 80.0, a molecular weight distribution (Mw/Mn) greater than 10, a reverse comonomer distribution, and a shear thinning index of from 5.0 to 20.0. Methods for producing the bimodal polyethylene, articles manufactured from the bimodal polyethylene are also provided.
    Type: Application
    Filed: July 7, 2021
    Publication date: September 28, 2023
    Applicant: Dow Global Technologies LLC
    Inventors: Mohamed Esseghir, Chuan C. He, Mridula Kapur, Andrew T. Heitsch, Theo Geussens, John F. Szul
  • Publication number: 20230265269
    Abstract: A polymeric composition includes (i) a copolymer of ethylene and an alpha olefin comonomer, the copolymer having a density of 0.945 g/cc to 0.960 g/cc, (ii) an ethylene-based polymer, and (iii) polyethylene glycol. The combination of (i) and (ii) has a High Mw Comonomer Content of 3.2 wt % or greater based on a total weight of the combined (i) and (ii) over the weight average molecular weight range of 105 g/mol to 105.5 g/mol as measured by GPC, wherein 15 wt % or greater of the total weight of the polymeric composition is the combined (i) and (ii) having a molecular weight in the range of 105 g/mol to 105.5 g/mol as measured by GPC, wherein the polymeric composition has a Relevant Comonomer Content of 0.6 wt % or greater and wherein the polymeric composition has a density of 0.945 g/cc or greater as measured according to ASTM D792.
    Type: Application
    Filed: October 4, 2021
    Publication date: August 24, 2023
    Inventors: Stacey A. Saba, Mohamed Esseghir, Theo Geussens, Yushan Hu, Brayden E. Glad, Andrew T. Heitsch, Buu-Dang Nguyen