Abstract: In an embodiment, a component includes a lead frame, a semiconductor chip and a housing body, wherein the lead frame has a first subregion and a second subregion laterally spaced from the first subregion, wherein the housing body laterally encloses the first subregion and the second subregion and thereby mechanically connects the first subregion to the second subregion, wherein the semiconductor chip is arranged on a mounting surface of the first subregion and is electrically conductively connected to the subregions of the lead frame, wherein the first subregion has a first local elevation, which vertically projects beyond at least one edge region of the first subregion, and, in top view of the mounting surface, at least partially surrounds the semiconductor chip, and wherein, in the top view of the mounting surface, the housing body completely covers the first local elevation and does not cover the semiconductor chip.

Abstract: Described are processes for the production of silver nanowires comprising forming a reaction mixture including a polyol, an organic chemical adsorbed to a silver surface, a chemical to form a halide and/or pseudohalide and a chemical which forms a redox pair. A silver salt is added to the reaction mixture and temperature is maintained to form the silver nanowires.