Patents by Inventor Theodor Fendt

Theodor Fendt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9112272
    Abstract: Winding a module antenna (MA) for an antenna module (AM) on a tubular support structure (SS) having have a lid structure (LD) or a planar tool (PT) disposed at its free end to constrain the windings. Alternatively, winding wire coils for module antennas (MA) on coil winding forms (CWF, FIG. 26) and transferring them to a module tape (MT). Double-sided and single-sided module tapes (MT) having vias and openings (h) are disclosed. Connection bridges (CBR) formed within, between or surrounding the contact pads (CP) are disclosed. Various configurations for components (CA, CC, EA) of booster antenna (BA) are disclosed. A coupler coil (CC) has an inner winding (iw) and an outer winding (ow). Techniques for embedding wire and for bonding wire are disclosed.
    Type: Grant
    Filed: November 13, 2013
    Date of Patent: August 18, 2015
    Assignee: Feinics Amatech Teoranta
    Inventors: David Finn, Jan Thomas Czornack, Mustafa Lotya, Theodor Fendt, Klaus Ummenhofer
  • Publication number: 20140104133
    Abstract: Winding a module antenna (MA) for an antenna module (AM) on a tubular support structure (SS) having have a lid structure (LD) or a planar tool (PT) disposed at its free end to constrain the windings. Alternatively, winding wire coils for module antennas (MA) on coil winding forms (CWF, FIG. 26) and transferring them to a module tape (MT). Double-sided and single-sided module tapes (MT) having vias and openings (h) are disclosed. Connection bridges (CBR) formed within, between or surrounding the contact pads (CP) are disclosed. Various configurations for components (CA, CC, EA) of booster antenna (BA) are disclosed. A coupler coil (CC) has an inner winding (iw) and an outer winding (ow). Techniques for embedding wire and for bonding wire are disclosed.
    Type: Application
    Filed: November 13, 2013
    Publication date: April 17, 2014
    Inventors: David Finn, Jan Thomas Czornack, Mustafa Lotya, Theodor Fendt, Klaus Ummenhofer