Abstract: Molded laminates useful in the preparation of electrically conductive panels are provided by a method comprising providing an article comprising a metal carrier or support layer, at least one insulating layer and a copper outer layer, the carrier having a plurality of perforations therethrough which are substantially filled with the insulating material, and compressing the layered article to produce a molded laminate. In other embodiments, the method comprises the further steps of forming a hole through at least some of the filled perforations, and, if desired, sensitizing the walls of the holes to electroless metal deposition and depositing a layer of metal thereon. Articles produced by the methods of this invention are also provided.