Abstract: The invention relates to a fuel injection device for diesel engines, which comprises an injection nozzle, a nozzle holder and a fuel high-pressure system. The fuel injection device has the following characteristics: The nozzle holder body (1) has a cavity (valve spring space) (26), which is connected to the fuel high-pressure system (12, 6) via a connecting line (27); the cavity is connected to the needle spring space (16) via a first pressure valve (18, 19) and a second pressure valve (21, 22); the first pressure valve opens to the needle spring space (16) and comprises a valve body (18) which is pressed by the spring force of the needle closing spring (14) onto its sealing seat (19) and can be lifted from its sealing seat (19) by the pressure inside the connecting line (27) whereby fuel flows from the valve spring space (26) into the needle spring space (16).

Abstract: A fuel injection pump for internal combustion engines, in particular one-cylinder diesel engines, has a pump piston (1) which can axially slide and rotate in a pump cylinder (13) with at least one fuel suction bore (14), a driving groove (6) arranged on the pump piston (1) parallel to the piston longitudinal axis, and geometrical connection between the front side (4) and the outer surface of the pump piston (1). In order to hydrodynamically regulate the optimum injection beginning during start, idle running and highest speed of rotation, a narrow slot (2,7) is provided as geometrical connection.

Abstract: A semiconductor device which is resistant against alternating thermal stres in which a disc of semiconductor material, which is provided with at least one pn-junction and with solderable contacting coatings on its opposite major surfaces, has these coatings permanently connected, in a direct planar manner, with current conducting connections by means of a soft solder. The soft solders employed are tin solders containing 3 to 8% antimony, 0.1 to 2% nickel, remainder tin, or 3 to 8% antimony, 0.1 to 3% copper, 0.1 to 2% cadmium, remainder tin, or 1 to 6% silver, 0.1 to 2% cadmium, remainder tin; cadmium solders containing 10 to 25% zinc, 1 to 5% silver, remainder cadmium, or 10 to 25% zinc, 5% silver, 3% copper, remainder cadmium; zinc solders containing 10 to 25% cadmium, 0.1 to 3% copper, remainder zinc; and lead solders containing 10 to 20% cadmium, 0.3 to 5% antimony, remainder lead, or 1 to 5% silver, 0.5 to 2% tin, 0.1 to 2% nickel, 0.1 to 3% copper, remainder lead.