Abstract: Techniques for analyzing performance of solar panels and/or cells are provided. In one aspect, a method for analyzing an infrared thermal image taken using an infrared camera is provided. The method includes the following steps. The infrared thermal image is converted to temperature data. Individual elements are isolated in the infrared thermal image. The temperature data for each isolated element is tabulated. A performance status of each isolated element is determined based on the tabulated temperature data. The individual elements can include solar panels and/or solar cells. In another aspect, an infrared diagnostic system is provided. The infrared diagnostic system includes an infrared camera which can be remotely positioned relative to one or more elements to be imaged; and a computer configured to receive thermal images from the infrared camera, via a communication link, and analyze the thermal images.

Abstract: Techniques for cooling in a data center are provided. In one aspect a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets, and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.

Abstract: Techniques for improving on data center best practices are provided. In one aspect, an exemplary methodology for analyzing energy efficiency of a data center having a raised-floor cooling system with at least one air conditioning unit is provided. The method comprises the following steps. An initial assessment is made of the energy efficiency of the data center based on one or more power consumption parameters of the data center. Physical parameter data obtained from one or more positions in the data center are compiled into one or more metrics, if the initial assessment indicates that the data center is energy inefficient. Recommendations are made to increase the energy efficiency of the data center based on one or more of the metrics.

Abstract: An apparatus for conducting heat from a computer component to a heat sink. The invention may include a thermal interface material (TIM). The invention may further include a seal or gasket that at least partially encloses the TIM. The gasket may facilitate retaining the TIM within its sidewall, and thus in place on or near a computer component. Generally, the gasket may be placed between the computer component (or a silicon board or other material upon which the computer component is located) and a heat sink. An insert may be placed within the gasket and define an aperture. The chip seats in the aperture and thus is spatially located with respect to the insert. The TIM abuts both the computer component and a heat sink. A desiccant may be located within the gasket and absorb any moisture diffusing or migrating through the gasket.

Abstract: An apparatus with one or more dimensions conforming to a wafer storage cassette used in semiconductor manufacturing which contains all or part of a sensor designed to measure a parameter of a wafer placed into the cassette. The intended use of the apparatus is in a process tool location normally occupied by a standard wafer cassette. By integrating all or part of the sensor into standard wafer storage cassette, a solution is provided whereby the same cassette and metrology system can be mechanically integrated into many process tools.

Abstract: An optical system includes a spectrometer and a multipass optical probe. The multipass optical probe includes a retroreflective element such that light propagating, in a first direction, from the probe to a sample under test and passing through or reflecting from the sample under test, is reflected back in a second direction opposite the first direction, so as to pass through the sample under test a total of at least two times.

Abstract: An apparatus with one or more dimensions conforming to a wafer storage cassette used in semiconductor manufacturing which contains all or part of a sensor designed to measure a parameter of a wafer placed into the cassette. The intended use of the apparatus is in a process tool location normally occupied by a standard wafer cassette. By integrating all or part of the sensor into standard wafer storage cassette, a solution is provided whereby the same cassette and metrology system can be mechanically integrated into many process tools.

Abstract: A method of detecting the presence of a brush used in a semiconductor wafer cleaner for post-CMP processing is described. Semiconductor wafers are loaded into the wet environment of the wafer cleaner, affixed to a rotatable fixture and rotated at high speed. The rotatable fixture is effectuated by a servo motor linked to a servo controller and a torque monitor. A first torque on the rotating wafer is calculated prior to the start of the brush cleaning cycle. During the brush cleaning cycle, as the brush within the brush cleaner contacts the rotating wafer, the torque on the wafer increases and a second torque is calculated. If, during the brush cleaning cycle, the second torque calculation is substantially equal to the first torque calculation, the brush cleaner is not contacting the wafer and cleaning has not progressed. A tool user can be notified to reaffix the brush within the cleaner.

Abstract: An apparatus for and method of detecting the presence of a brush used in a semiconductor wafer cleaner for post-CMP processing is described. Semiconductor wafers are loaded into the wet environment of the wafer cleaner, affixed to a rotatable fixture and rotated at high speed. The rotatable fixture is effectuated by a servo motor linked to a servo controller and a torque monitor. A first torque on the rotating wafer is calculated prior to the start of the brush cleaning cycle. During the brush cleaning cycle, as the brush within the brush cleaner contacts the rotating wafer, the torque on the wafer increases and a second torque is calculated. If, during the brush cleaning cycle, the second torque calculation is substantially equal to the first torque calculation, the brush cleaner is not contacting the wafer and cleaning has not progressed. A tool user can be notified to reaffix the brush within the cleaner.

Abstract: Structures having high height to width ratios may be measured using X-ray techniques, where the surrounding base and the structure are composed of different substances. The technique combines X-ray detection with scanning electron microscope (SEM) beam scanning. The X-ray emission is set to detect the presence of a specific substance which is either in the structure or surrounding the structure.

Abstract: Apparatus suitable for transforming a radiation beam so that it can exit with a predetermined alteration. The apparatus includes a first variably diffractive radiation element for transforming a characteristic of the radiation beam from an original state; a second radiation element juxtaposed to the first radiation element for transforming the same characteristic in a complementary way; and, means for physically deforming the first variably diffractive radiation element so that its diffracting pattern can change in a known way.

Abstract: An assembly for making thickness measurements in a thin film structure. The assembly comprises a chemical-mechanical planarization (CMP) subassembly for effecting topographical changes in a thin film structure; and, a measuring subassembly for detecting the thickness of a thin film structure, the measuring subassembly interposed with the CMP subassembly so that a thickness measurement can be made during and independent of CMP process operations.